About IEEE Transactions on Cloud Computing

Contact Information

Editor-in-Chief
Hui Lei
IBM
1101 Kitchawan Road
Yorktown Heights, NY 10598
dr.huilei@gmail.com

Associate Editor-in-Chief

Yuanyuan Yang
Stony Brook University, USA
yuanyuan.yang@stonybrook.edu

TCC Publication Coordinator
IEEE Computer Society
10662 Los Vaqueros Circle
Los Alamitos, CA 90720, USA
EMAIL:TCC@computer.org
PHONE: +1.714.821.8380
FAX: +1.714.761.1784

Scope of TCC

The IEEE Transactions on Cloud Computing (TCC) publishes peer reviewed articles that provide innovative research ideas and applications results in all areas relating to cloud computing. Topics relating to novel theory, algorithms, performance analyses and applications of techniques relating to all areas of cloud computing are considered for the transactions. The transactions considers submissions specifically in the areas of cloud security, tradeoffs between privacy and utility of cloud, cloud standards, the architecture of cloud computing, cloud development tools, cloud software, cloud backup and recovery, cloud interoperability, cloud applications management, cloud data analytics, cloud communications protocols, mobile cloud, liability issues for data loss on clouds, data integration on clouds, big data on clouds, cloud education, cloud skill sets, cloud energy consumption, and cloud applications in commerce, education and industry. This title also considers submissions on Infrastructure as a Service (IaaS), Platform as a Service (PaaS), Software as a Service (SaaS), and Business Process as a Service (BPaaS).

Additional Information

Note: TCC publishes Special Issues in collaboration with top Cloud Computing conferences, whereas the following rules are applied:

  • TCC is provided the top 20% of the papers, verifies them by EDAS, and picks the best to invite.
  • The invited papers go under regular TCC peer review process.
  • The conference does not publish SIs with other publications.

Editorial Board

Editor-in-Chief

Hui Lei - IBM, USA

Associate Editor-in-Chief

Yuanyuan Yang - Stony Brook University, USA

Associate Editors

Saeid Abolfazli - YTL Communications and Xchanging, Malasysia

Gagan Agrawal - Ohio State University, USA

Pavan Balaji - Argonne National Laboratory, USA

Umesh Bellur - Indian Institute of Technology (IIT) Bombay, India

Boualem Benatallah - University of New South Wales

Bharat Bhargava - Purdue University

Ivona Brandic - Vienna University of Technology, Austria

Roy Campbell - University of Illinois, Urbana-Champaign, USA

K. Selcuk Candan - Arizona State University, USA

Jiannong Cao - Hong Kong Polytechnic University

Junwei Cao - Tsinghua University, China

Abhishek Chandra - University of Minnesota

Jinjun Chen - University of Technology Sydney, Australia

Beng Chin OOI - National University of Singapore, Singapore

Peter Corcoran - National University of Ireland, Galway (NUI Galway)

Yong Cui - Tsinghua University, China

Dilma Da Silva - Texas A&M University, USA

Cesar Augusto F De Rose - PUCRS, Brazil

Murat Demirbas - SUNY Buffalo, USA

David De Roure - Oxford University, UK

Janakiram Dharanipragada - Indian Institute of Technology (IIT) Madras, India

Beniamino Di Martino - Second University of Naples, Italy

Vladimir Dimitrov - University of Sofia, Bulgaria

Erik Elmroth - Umeå University and Elastisys, Sweden

Dick Epema - Delft University of Technology, The Netherlands

Thomas Fahringer - University of Innsbruck , Austria

Geoffrey Fox - Indiana University, USA

Erol Gelenbe - Imperial College, London, UK

Mohan Gurusamy - National University of Singapore, Singapore

Bingsheng He - Nanyang Technological University, Singapore

Ching-Hsien (Robert) Hsu - Chung Hua University, Taiwan

Pan Hui - Hong Kong University of Science and Technology, China

Kai Hwang - University of Southern California, USA

Arun Iyengar - IBM Watson Research, USA

Hai Jin - Huazhong University of Science & Technology, China

Dzmitry Kliazovich - University of Luxembourg, Luxembourg

Chandra Krintz - University of California, Santa Barbara, USA

Ruby B. Lee - Princeton University, USA

Jie Li - University of Tsukuba

Keqin Li - State University of New York (SUNY) at New Paltz, USA

Ignacio Martín Llorente - Universidad Complutense de Madrid, Spain

Heiko Ludwig - IBM Almaden Research, USA

Dejan Milojicic - HP Labs, USA

Vojislav Misic - Ryerson University, Canada

Leandro Navarro - UPC, Spain

Manish Parashar - Rutgers University, USA

Vincenzo Piuri - Universita degli Studi di Milano

Meikang Qiu - San Jose State University, USA

Ioan Raicu - Illinois Institute of Technology, Chicago, USA

Omer Rana - Cardiff University, UK

Rajiv Ranjan - CSIRO, Australia

Chunming Rong - University of Stavanger, Norway

Pierangela Samarati - Università degli Studi di Milano, Italy

Bruno Schulze - LNCC, Brazil

Hong Shen - University of Adelaide, Australia

Kwang Mong Sim - University of Kent, UK

Radu Sion - Stony Brook University

Ramesh Sitaraman - University of Massachusetts, Amherst, USA

Neeraj Suri - TU Darmstadt

Stefan Tai - TU Berlin, Germany

Domenico Talia - Università della Calabria, Italy

Vijaya Varadharajan - Macquarie University, Australia

Carlos Varela - Rensselaer Polytechnic Institute, USA

Athanasios V. Vasilakos - Lulea University of Technology, Sweden

Anwar Walid - Bell Labs, USA

Cho-Li Wang - The University of Hong Kong, China

Jun Wang - University of Central Florida

Lizhe Wang - Chinese Academy of Sciences, China

Xiaorui Wang - Ohio State University

David S. L. Wei - Fordham University, USA

Yongwei Wu - Tsingghua University, China

Cheng-Zhong Xu - Wayne State University, USA

Haiping Xu - University of Massachusetts, Dartmouth, USA

Yun Yang - Swinburne University of Technology, Australia

Xiaofang Zhou - University of Queensland, Australia

Albert Zomaya - University of Sydney, Australia


Steering Committee

IEEE Computer Society

IEEE Communications Society

IEEE Systems Council

IEEE Power & Energy Society

IEEE Consumer Electronics Society