CLOSED Call for Papers: Special Issue on Security and Privacy of Deep-Learning-as-a-Service (DLaaS) Computing Systems

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Submissions Due: 30 November 2020

IEEE Transactions on Computers seeks original manuscripts for a special issue on “Security and Privacy of Deep-Learning-as-a-Service (DLaaS) Computing Systems,” scheduled to appear in 2021.

Deep Learning (DL) as a Service (DLaaS) has become the current trend for end-users or small enterprises for using DL techniques by purchasing computing services from IT corporations. Such a solution has effectively reduced the cost of DL training and DL inference by combining heterogeneous computing models with the specific hardware and system for DL algorithms. Challenging security issues are also introduced, including security issues on dedicated hardware of DLaaS, such as GPGPU, TPU, and ASIC; security and privacy issues on systems or algorithms of DLaaS, such as neural networks, online inferencing, and differential privacy; and special use cases of deploying DLaaS, such as IoT, edge computing, and mobile clouds.

For this special issue, we expect contributions in security and privacy research problems specific to DLaaS computing systems. Topics of interest include, but are not limited to:

  • Differential Privacy Attack and Defense in DLaaS Systems
  • Secure Deep Learning in Cloud Computing, IoT, Edge Computing, and Mobile Cloud Computing
  • Attack and Defense Methods on Backdoor Attacks in DLaaS Systems
  • Attack and Defense on Adversarial Examples in DLaaS Systems
  • Hardware-Level Attack and Defense in DLaaS Systems
  • Energy-Oriented Attack and Defense in DLaaS Systems
  • Data-Centric Security in DLaaS Systems
  • Other Attack and Defense on Systems, Models, and Data Sets in DLaaS Systems

Submitted papers must include new significant research-based technical contributions in the scope of the journal. Papers under review elsewhere are not acceptable for submission. Extended versions of published conference papers (to be included as part of the submission together with a summary of differences) are welcome, but there must be at least 40% new impacting technical/scientific material in the submitted journal version and there should be less than 50% verbatim similarity level as reported by a tool (such as CrossRef). Guidelines concerning the submission process and LaTeX and Word templates can be found here. While submitting through ScholarOne, please select this special issue option. Per TC policies, only full-length papers (12+ pages) can be submitted to special issues, and each author’s bio should not exceed 150 words. Papers that are not published in this special issue will be considered for a regular issue of TC.

Please note the following important dates:
• Open for Submission: November 1, 2020
• Submission Deadline: November 30, 2020
• Reviews Completed: January 15, 2021
• Major Revisions Due: February 15, 2021
• Reviews of Revisions Completed: March 15, 2021
• Notification of Final Acceptance: April 1, 2021
• Publication Materials for Final Manuscripts Due: April 15, 2021
• Publication Date: July 2021

Guest Editors

Please address all correspondence regarding this special issue to Lead Guest Editor Meikang Qiu (qiumeikang@yahoo.com).

  • Prof. Meikang Qiu (Lead), Texas A&M University, Commerce, USA
  • Prof. Bhavani Thuraisingham, University of Texas at Dallas, USA
  • Prof. Sun-Yuan Kung, Princeton University, USA
  • Prof. Elisa Bertino, Purdue University, USA

Coordinating Topical Editor (CTE)

Prof. Hong Jiang, University of Texas at Arlington, USA (hong.jiang@uta.edu)

Review Committee

Zakirul Alam Bhuiyan, Fordham University
Weipeng Cao, Shenzhen University
Barbara Carminati, University of Insubria
Feng Chen, University of Texas at Dallas
Chris Clifton, Purdue University
Mian Xiong Dong, Muroran Institute of Technology
Mohammad Mehedi Hassan, King Saud University
Karuna Joshi, University of Maryland Baltimore
Murat Kantarcioglu, University of Texas at Dallas
Laifur Khan, University of Texas at Dallas
Yibin Li, Shandong University
Siqi Ma, University of Queensland
Han Qiu, Telecom Paris tech
Anna Squicciarini, Pennsylvania State University
Rakesh Verma, University of Houston
Yulei Wu, University of Exeter
Peng Zhang, SUNY Stonybrook
Cheng Zhang, Waseda University
Yongxin Zhu, Shanghai Advanced Research Institute
Shui Yu, University of Technology Sydney
M. Shamim Hossain, King Saud University
Zongming Fei, University of Kentucky
Peng Li, Aizu Univeristy, Japan
Suhua Tang, University of Electro-Communications, Japan
Baijian Yang, Purdue University, USA
Zhi Liu, Shizuoka University, Japan
Yoshihiko Hayashi, Waseda University, Japan
Haibo Zhang, University of Otago, New Zealand
Gerard Memmi, Telecom Paris, France
Linghe Kong, Shanghai Jiao Tong University, China
Xuyun Zhang, University of Auckland, New Zealand
Alireza Jolfaei, Macquarie University, Australia