Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley.The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. It is widely covered by the media; last year, we had about 25 members of the industry and national press covering the conference.Presentations at HOT CHIPS are in the form of 30-minute talks. Presentation slides are published in the HOT CHIPS proceedings and online in the archives section of the HOT CHIPS website. Participants are not required to submit written papers, but a select group are invited to submit a paper for inclusion in a special issue of IEEE Micro.The conference emphasis this year, as in previous years, is on real products and realizable technology. Submissions are invited from a variety of “hot” topics, including:
General-Purpose Processor Chips
High-Performance, Low-Power
Multi-Core and Highly-Reliable Systems
Domain-Specific Chips
Machine Learning, Vision and Graphics Chips
Data Analytics and Big Data Processing
IoT and Always-On Functions
Custom Chips for Emerging Applications
Reconfigurable Chips
FPGAs and FPGA-Based Systems
Coarse-Grained Reconfigurable Arrays
Security
Secure Hardware
Hardware Support for Software Security
Mobile and Embedded Devices
Graphics/Multimedia/Gaming
SoC, Security, and DSP Chips
Communications and Networking
Wireless LAN/WAN/PAN
Network and I/O Processors
Emerging Computing Architectures
Neuromorphic
Quantum Computing
Memory Technologies
MRAM, PCM, ReRAM, or FRAM
Persistent Memory, Phase Change
Packaging, 3D, Stacked
Other Enabling Technologies
Power and Thermal Management
Packaging and Testing
Display Technologies
On-Chip Optics & Sensors
Novel Computing Technologies
Software and Systems for Emerging Hardware
Programming Models, Runtime Systems
Performance, Power, Debug, and Evaluation
Submission Details
Submissions must consist of the following:
“Presentation” or “Poster”
Title
Extended abstract (two pages maximum)
Presenter’s contact information (name, affiliation, job title, address, phone(s), and email)
Indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
Indication if you would like the submission to be held confidential
Evaluation Criteria
Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.
Presentation Guidelines
Presentations at Hot Chips are in the form of 30-minute talks using PowerPoint or PDF. Presentation slides will be published in the Hot Chips Proceedings. Participants are not required to submit written papers, but selected papers will be invited to submit a paper for inclusion in a special issue of IEEE Micro.
Poster Guidelines
Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. Program related questions/comments?
