Submissions due: CLOSED
Publication: November/December 2020
With slowing down of the dimensional scaling in advanced CMOS technologies coupled with the rise of custom hardware accelerators for energy-efficient computing in a variety of AI/ML, AR/VR applications, integrated circuits (ICs) are transforming rapidly to meet the power, performance, security, and connectivity demands of such systems and architectures. This special issue of IEEE Micro aims at publishing some of the most significant research that can highlight the trends in IC design in 2020 and provide directions for the future IC design era. The scope of the paper submissions is very broad to cover many aspects of modern IC designs, including but not limited to state-of-the-art chip design in 2020 and challenges in:
- Lithography/process
- Novel logic and memory devices
- 3D integration methodologies
- EDA methodologies (verification, test, physical design)
- Hot, Cool, and Unique Chips in 2020
- Custom mixed signal and RF circuits
- Neural network (DNN, SNN) accelerators
Important Dates
- Submissions due: May 11, 2020
- Initial notifications: June 29, 2020
- Revised papers due: August 3, 2020
- Final notifications: September 7, 2020
- Final versions due: September 19, 2020
- Publication date: Nov/Dec 2020
Submission Guidelines
Articles should be no more than 5,000 words including figures, each of which counts as 250 words. Submit electronically through ScholarOne Manuscripts, selecting this special-issue option. Article templates are not required, but can be found here. Other author information regarding article preparation and submission can be found here.
Questions?
Contact the guest editor, Jaydeep Kulkarni (jaydeep@austin.utexas.edu), or the editor-in-chief, Lizy K. John (ljohn@ece.utexas.edu).
