CLOSED Call for Papers: Special Issue on Communications for Many-Core Processors and Accelerators

IEEE Transactions on Computers seeks original manuscripts for this upcoming special issue.
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Submissions Due: 15 August 2020

Communications in various forms have become increasingly important with the advent of diverse computing platforms, such as many-core CPUs, GPUs, FPGAs, machine learning (ML) accelerators, and other domain-specific processors. Meanwhile, data-intensive workloads pose greater challenges to both on-chip and off-chip communications, whereas emerging technologies offer new opportunities for interconnection networks. These trends on architecture, application, and technology require innovative communication designs for the next generation of computing systems. This special issue of IEEE Transactions on Computers will explore academic and industrial research on all topics related to the communication issues in general-purpose and domain-specific processors. Topics of interest to this special issue include, but not limited to:

  • Communication architecture for ML accelerators and other app/domain-specific processors
  • Network interface designs for intra/inter-chip and rack-scale networks
  • Security, reliability, and scalability of communications
  • On-chip network architecture and implementation for CPUs, GPUs, and FPGAs
  • Emerging interconnect technologies, such as optical, wireless, CNT, and 2.5D/3D
  • New design methodologies (including ML-based) for communications
  • Communication modeling/characterization, benchmarking, simulation, and verification
  • Communications at un-core level, e.g., interactions with memory controllers, caches, and storages
  • Communications at large scale (data center, edge, and fog computing)
  • Co-optimizations of communications with OS, compilers, and programming models

Submitted articles must not have been previously published or currently submitted for journal publication elsewhere. Extended versions of published conference papers (to be included as part of the submission together with a summary of differences) are welcome, but they must have at least 40% new impacting technical/scientific material in the submitted journal version, and there should be less than 50% verbatim similarity as reported by a tool (such as CrossRef). Of note, authors are responsible for understanding and adhering to the TC submission guidelines. Papers should be submitted via ScholarOne Manuscripts by selecting the special-issue option. As per TC policies, only full-length papers (at least 12 pages and according to TC submission requirements) can be submitted to this special issue, and each author’s bio should not exceed 150 words.

Important Dates

  • Open for Submissions: August 1, 2020
  • Submission Deadline: August 15, 2020
  • Reviews Completed: October 1, 2020
  • Major Revisions Due: November 1, 2020
  • Reviews of Revisions Completed: November 15, 2020
  • Notification of Final Acceptance: November 22, 2020
  • Publication Materials for Final Manuscripts Due: December 7, 2020
  • Publication: January 2021

Guest Editors

Please address all correspondence regarding this special issue to the guest editors:

Lizhong Chen
School of EECS, Oregon State University

Zhonghai Lu
KTH Royal Institute of Technology

Corresponding Topical Editor

Cristina Silvano
Politecnico di Milano

Review Committee

Sergi Abadal, Universitat Politècnica de Catalunya
Fawaz Alazemi, Kuwait University
Jimmy Chen, National Sun Yat-sen University
Hughes Clayton, Sandia National Laboratories
Huaxi Gu, Xidian University
Xiaochen Guo, Lehigh University
Axel Jantsch, TU Vienna
Yin Jieming, Lehigh University
John Kim, KAIST
Ryan Kim, Colorado State University
Eun Jung Kim, Texas A&M University
Michihiro Koibuchi, National Institute of Informatics
Tushar Krishna, Georgia Tech, USA
Sheng Ma, National University of Defense Technology
Partha Pratim Pande, Washington State University
Martin Radetzki, University of Stuttgart
En Shao, ICT, Chinese Academy of Sciences
Baris Taskin, Drexel University
Ishan Thakkar, Colorado State University
Jiang Xu, Hong Kong University of Science and Technology
Yuan Yao, Uppsala university
Hui Zhao, University of North Texas