Conference date: 4-6 August 2025
IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025)
The IEEE International Conference on Omni-Layer Intelligent Systems (IEEE COINS 2025) invites submissions for original research, technical papers, and proposals on AI and Smart Systems. IEEE COINS serves as a global forum for academic and industry leaders to discuss the latest advancements in digital transformation and intelligent systems.
IEEE COINS 2025 will be held at the University of Wisconsin–Madison, USA, offering a vibrant and collaborative environment to explore cutting-edge research and technological innovations.
We invite submissions of high-quality research contributions that address technological advancements, theoretical frameworks, design methodologies, and real-world applications of AI, IoT, and Smart Systems. Topics include but are not limited to:
Topical Areas:
Industry & Vertical Applications:
In addition to submitting your paper to IEEE COINS 2025, you are also encouraged to upload the data related to your paper to IEEE DataPort. IEEE DataPort is IEEE's data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility. Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive. Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission. Thank you!
We also welcome proposals for:
IEEE COINS 2025 is proudly supported by:
Join us in shaping the future of intelligent systems. Submit Your Paper Now: IEEE COINS 2025 Submission.
We welcome you to the University of Wisconsin–Madison for IEEE COINS 2025.