Explore the November Issue of IEEE VLSI Circuits and Systems Letter (VCAL)
Provided By The Technical Committee on Very Large Scale Integration
By IEEE Computer Society on
The Technical Committee on Very Large Scale Integration (TCVLSI) of the IEEE Computer Society (IEEE-CS) addresses the interactions among the various aspects of VLSI design including system-level design, logic-level design, circuit-level design, and semiconductor processes. It also covers the computer-aided design techniques to facilitate the VLSI design process. The VLSI may include digital circuits and systems, analog circuits, as well as mixed-signal circuits and systems.
The VLSI Circuits and Systems Letter (VCAL) quarterly newsletter aims to provide timely updates on technologies, educations and opportunities related to VLSI circuits and systems. The November 2020 issue features an editorial by outgoing Editor, Dr. Anirban Sengupta; an interview with the incoming Editor and new TCVLSI Chair, Dr. Mondira (Mandy) Pant, and two articles related to Organic FETs and charge plasma-based dopingless Gate All Around Nanowire FETs. Additionally, funding and job (some industry and post-doc) opportunities and upcoming relevant IEEE conferences and workshops are included.
Explore Outgoing Editor-in-Chief of IEEE VCAL, TCVLSI, Anirban Sengupta, Ph.D, editorial below, and read the rest of the article today!
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From the Outgoing Editor-in-Chief’s Desk - Editorial
The IEEE VLSI Circuits and Systems Letter (VCAL) is affiliated with the Technical Committee on VLSI (TCVLSI) under the IEEE Computer Society. It aims to report recent advances in VLSI technology, education and opportunities and, consequently, grow the research and education activities in the area. The letter, published quarterly (from 2018), covers the design methodologies for
advanced VLSI circuit and systems, including digital circuits and systems, hardware security, design for protection, analog and radiofrequency circuits, as well as mixed-signal circuits and systems. The emphasis of TCVLSI falls on integrating the design, secured computer-aided design, fabrication, application, and business aspects of VLSI while encompassing both hardware and software.
IEEE TCVLSI sponsors a number of premium conferences and workshops, including, but not limited to, ASAP, ASYNC, ISVLSI, IWLS, SLIP, and ARITH. Emerging research topics and state-of-the-art advances on VLSI circuits and systems are reported at these events on a regular basis. Best paper awards are selected at these conferences to promote the high quality research work each year. In addition to these research activities, TCVLSI also supports a variety of educational activities related to TCVLSI. Several student travel grants are sponsored by TCVLSI in the following meetings: ASAP, ISVLSI, IWLS, iSES (formerly iNIS) and SLIP. Funds are provided to compensate student travels to these meetings as well as attract more student participation. The organizing committees of these meetings undertake the task of selecting right candidates for these awards.
The current issue of VCAL showcases the state-of-the-art developments covering several important articles: ‘UV Photo Response of Semiconductor: Polymer blend Organic Field Effect Transistors’ and ‘Analysis of conventional doped and charge plasma dopingless Silicon Nanowire FET’. The peer-reviewed articles can be found in the section of “Features Articles”. In the section of “Updates”,
upcoming conferences/workshops, call for papers and proposals, funding opportunities, job openings, conference report and Ph.D.fellowships are summarized.
Since my 2 year term as Chair TCVLSI and 3 year term as EiC TCVLSI newsletter are both complete, hence I have handed over both my charges to the new Chair and incoming EiC of TCVLSI, Dr. Mondira (Mandy) Pant (Intel, USA). Let me welcome her forthis new responsibility. I am sure she will take TCVLSI to greater heights and glory.
During this tenure, I got an opportunity to work with some wonderful people, as well as was part of several initiatives for TCVLSI. Now it’s time to thank everyone for their support. I would like to thank all editorial board members (Yiyu Shi, Jun Tao, Himanshu Thapliyal, Nicolas Sklavos, Sergio Saponara, Shiyan Hu, Hideharu Amano, Mike Borowczak, Helen Li, Saket Srivastava, Yasuhiro Takahashi, James Stine, Michael Hübner and Qi Zhu) for their dedicated effort as well as all TCVLSI members for their constant support. I am also thankful to IEEE CS staffs, for their professional services to make the letter publicly available. I wish to thank all authors who have contributed their professional articles to this issue. The call for contributions for the next issue is available at the end of this issue and we encourage you to submit articles, news, etc. to an associate editor covering that scope.
