Call for Submissions: IEEE Hot Chips 2026

Conference dates: 23-25 August 2026 | Palo Alto, CA, USA

The submission site for Hot Chips 2026 is now open. We are seeking technical presentations on important, real-world processors and systems-on-chip. If you are an engineer working on significant new silicon, we invite you to submit your work for this year's program.

In addition to technical presentations, we are also seeking posters, particularly from students. We will present a Hot Chips 2026 Best Student Poster award selected from accepted posters at the conference.

Learn More


Why Participate?

  • Share your work with international experts and peers, and gain valuable feedback

Opportunities

  • Present your emerging ideas and applications
  • Showcase your demos of innovative systems, tools, prototypes, and interactive experiences
  • Utilize your platform to share new advances, ideas, and solutions
  • Highlight your contributions
  • Contribute to event programming and technical content
  • Experience groundbreaking workshops, special sessions, and panels

Topics

  • General-Purpose Processor Chips
    • High-Performance, Low-Power
    • Multi-Core and Highly-Reliable Systems
  • Domain-Specific Chips
    • AI Accelerators
    • Graphics Chips
    • Machine Learning Chips
    • Data Analytics and Big Data Processing
    • IoT and Always-On Functions
    • Custom Chips for Emerging Applications
  • Reconfigurable Chips
    • FPGAs and FPGA-Based Systems
    • Coarse-Grained Reconfigurable Arrays
  • Security
    • Secure Hardware
    • Hardware Support for Software Security
  • Mobile and Embedded Devices
    • Graphics/Multimedia/Gaming
    • SoC, Security, and DSP Chips
  • Communications and Networking
    • Wireless LAN/WAN/PAN
    • Network and I/O Processors
  • Emerging Computing Architectures
    • Neuromorphic
    • Quantum Computing
    • Analog Computing, Photonic Chips
  • Memory Technologies
    • Emerging Memory
    • Packaging, 3D, Stacked
  • Other Enabling Technologies
    • Power and Thermal Management
    • Sustainable Computing
    • Generative Tools
    • Packaging and Testing
    • Display Technologies
    • On-Chip Optics & Sensors
    • Novel Computing Technologies
  • Software and Systems for Emerging Hardware
    • Programming Models, Runtime Systems
    • Performance, Power, Debug, and Evaluation

Submit Your Content

In addition to submitting your paper to IEEE Hot Chips 2026, you are also encouraged to upload the data related to your paper to IEEE DataPort.  IEEE DataPort is IEEE’s data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility.  Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive.  Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission.  Thank you!