Technical Community on Microprocessors and Microcomputers (TCMM)
TCMM addresses the architecture, design, and application of microprocessors and microcomputers, as well as sponsors the Hot Chips and Hot Interconnects conferences.
What Are the Benefits of Joining TCMM?
The IEEE Technical Community on Microprocessors and Microcomputers (TCMM) supports innovation in embedded systems, processor design, and high-performance microarchitectures.
Members contribute to conferences like Hot Chips, Hot Interconnects, and Cool Chips, and participate in publications through IEEE Micro. TCMM also promotes student engagement through poster sessions and travel awards.
Membership is free and open to all. Join to get involved in microprocessor research and development.
Join the Technical Community on Microprocessors and Microcomputers (TCMM) to advance innovation in architecture, design, and applications of high-performance and low-power hardware and software for computing and networking systems.
EMAIL TCMM CHAIRExecutive Committee
- Chair: Gabriel Southern
- Vice Chair: John Davis
TCMM-Sponsored Conferences
- IEEE International Workshop on Cool Chips (COOL CHIPS)
- IEEE International Conference on Optical and Photonic Materials and Devices (COPA)
- IEEE International Symposium on High-Performance Computer Architecture (HCS)
- IEEE International Symposium on High-Performance and Reconfigurable Computing Systems (HOTI)
- IEEE International Conference on Microelectronic Systems-on-Chip (MCSoC)
