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Issue No.04 - July/August (vol.27)
ISSN: 0740-7475
TABLE OF CONTENTS
Call for Papers
From the EIC
Emerging Interconnect Technologies for Gigascale Integration
Ron Ho , Oracle
Frankie Liu , Oracle
Dinesh Patil , Oracle
Xuezhe Zheng , Oracle
Guoliang Li , Oracle
Ivan Shubin , Oracle
Elad Alon , Oracle
Jon Lexau , Oracle
pp. 10-19
Hong Li , University of California, Santa Barbara
Chuan Xu , University of California, Santa Barbara
Kaustav Banerjee , University of California, Santa Barbara
pp. 20-31
Patrick Yin Chiang , Oregon State University
Sirikarn Woracheewan , Oregon State University
Changhui Hu , Oregon State University
Lei Guo , Oregon State University
Rahul Khanna , Intel
Jay Nejedlo , Intel
Huaping Liu , Oregon State University
pp. 32-43
Alireza Nojeh , University of British Columbia
Andre Ivanov , University of British Columbia
pp. 44-53
Zheng Li , Tsinghua University
Moustafa Mohamed , University of Colorado at Boulder
Hongyu Zhou , University of Colorado at Boulder
Li Shang , University of Colorado at Boulder
Alan R. Mickelson , University of Colorado at Boulder
Dejan S. Filipovic , University of Colorado at Boulder
Dejan S. Filipovic , University of Colorado at Boulder
Manish Vachharajani , University of Colorado at Boulder
Xi Chen , University of Colorado at Boulder
Wounjhang Park , University of Colorado at Boulder
Yihe Sun , Tsinghua University
pp. 54-67
Book Reviews
Chips in 3D (HTML)
Igor Markov , University of Michigan
pp. 68-69
The Road Ahead
When is 3D 2B? (Abstract)
Andrew B. Kahng , University of California, San Diego
pp. 70-71
CEDA Currents
DATC Newsletter
Conference Reports
Conference Reports (Abstract)
Rohit Kapur , Synopsys
pp. 77
TTTC Newsletter
The Last Byte
Radu Marculescu , Carnegie Mellon University
pp. 80
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