IEEE Transactions on Emerging Topics in Computing

Covering aspects of computer science, computing technology, and computing applications not currently covered by other IEEE Computer Society Transactions


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From the April-June 2017 issue

High-Performance, Cost-Effective 3D Stacked Wide-Operand Adders

By George Razvan Voicu and Sorin Dan Cotofana

Featured article thumbnail imageThrough-Silicon Vias (TSV) based 3D Stacked IC (3D-SIC) technology introduces new design opportunities for wide operand width addition units. Different from state of the art direct folding proposals we introduce two cost-effective 3D Stacked Hybrid Adders with identical tier structure, which potentially makes the manufacturing of hardware wide-operand fast adders a reality. An $N$ -bit adder implemented on a $K$ identical tier stacked IC performs in parallel two $N/K$ -bit additions on each tier according to the anticipated computation principle. Inter-tier carry signals performing the appropriate sum selection are propagated by TSVs. The practical implications of direct folding and of our hybrid carry-select/prefix approaches are evaluated by a thorough case study on 65 nm CMOS 3D adder implementations, for operand sizes up to 4,096 bits and 16 tiers. Our simulations indicate that in almost all configurations at least one of the two proposed 3D stacked hybrid approaches is faster than the fastest 3D folding approach. When considering an appropriate metric for 3D designs, i.e., the delay-footprint-heterogeneity product, the hybrid adders substantially outperform the folding counterparts by a factor in-between $1.67\times$ and $23.95\times$ .

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Call for Papers

Technical Tracks

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IEEE Transactions on Emerging Topics in Computing (TETC) seeks original manuscripts for submission under Technical Tracks. In a track the technical contents of a submitted manuscript must be of an emerging nature and fall within the scope and competencies of the Computer Society. Manuscripts not abiding by these specifications will be administratively rejected. The topics of interest for the Technical Tracks are as follows:

  • Enterprise Computing Systems
  • Computational Networks
  • Hardware and Embedded System Security
  • Educational Computing
  • High Performance Computing
  • Next Generation Wireless Computing Systems
  • Computer System Security
  • Emerging Hardware for Computing

Submitted articles must describe original research which is not published or currently under review by other journals or conferences. Extended conference papers should be identified in the submission process and have considerable novel technical content; all submitted manuscripts will be screened using a similarity checker tool. As an author, you are responsible for understanding and adhering to our submission guidelines. You can access them at the IEEE Computer Society web site, www.computer.org. Please thoroughly read these before submitting your manuscript.

Please submit your paper to Manuscript Central at https://mc.manuscriptcentral.com/tetc-cs and select the "Technical Track" option in the drop-down menu for "Manuscript Type".

Please address all other correspondence regarding this Call For Papers to Fabrizio Lombardi, EIC of IEEE TETC, lombardi@ece.neu.edu

Special Issue on Advanced Command, Control and On-Board Data Processing for Space Avionic Systems

Submission deadline: September 1, 2017. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on Command, control and on board data processing for space avionic systems scheduled to appear in the third issue of 2018.The domain of space avionic systems is changing extremely rapidly, compared to other technical domains in space-faring industry, under the pressure of an intense competition, the continuous emergence of new markets and players, the need for cost reduction, as well as an increased obsolescence rate of components and processes.

This rapidly changing landscape is as well opening a large amount of opportunities for the space avionic systems: the new high-performance processors architectures and silicon processes, which offer the possibility to integrate different functions until now implemented on several boards either in a single chip (SoC), or in application-specific standard products (ASSP) or in new large FPGAs are allowing multi-fold gains in performances and miniaturization for electronic systems.

Reliability and availability constraints remain the main driving requirements for established space hardware manufacturers. In this context, the emergence of space systems based on Commercial-Off-The-Shelf (COTS) only and aggressive commercial platforms adds further uncertainties and possibilities to an already very dynamic landscape. New creative and technically sound solutions are needed to provide a valid and attractive alternative to the tempting shortcut of cutting costs by waving the rigorous test and quality assurance processes applied to bigger satellite.

Special Issue on Green Computing in Internet of Things

Submission deadline: September 1, 2017. View PDF.

As an emerging cross-disciplinary research area, Green Computing is attracting worldwide attention. The emergence of the Green Computing will significantly change the way we see the world. All aspects of Information Technology are under investigation, from energy saving design of individual devices, to strategies that consider the entire energy consumption in the design, planning, and management phases, to new paradigms for long term sustainability that includes reformed attitudes of users’ as well as smart energy harvesting techniques. The above considerations motivated us to promote this special issue. This special issue will bring together academic and industrial researchers to identify and discuss technical challenges and recent results related to Green Computing in Internet of Things. Only papers that are focused on computing will be considered.

Special Issue on eGovernment Development and Applications (SIEGDA)

Submission deadline: September 1, 2017. View PDF.

The SIEDGA addresses the main issues of public administration and electronic democracy with an academic and practical perspective. It covers technical and non-technical aspects of, but not limited to the following areas: eGovernment, eDemocracy, eParticipation, eScociety, eHealth, and eGovernance.

Special Issue on Scholarly Big Data

Submission deadline: December 1, 2017. View PDF.

Recent years have witnessed the rapid growth of scholarly information due to advancements in information and communication technologies. Scholarly big data is the vast quantity of research output, which can be acquired from digital libraries, such as journal articles, conference proceedings, theses, books, patents, experimental data, etc. It also encompasses various scholarly related data, such as author demography, academic social networks, and academic activity. The abundance of scholarly data sources enables researchers to study the academic society from a big data perspective. The dynamic and diverse nature of scholarly big data requires different data management techniques and advanced data analysis methods. Today’s researchers realize that new scholarly-big-data specific platform/management/techniques/ are needed. Therefore, a set of emerging topics such as scholarly big data acquisition, storage, management and processing are important issues for the research community. Manuscripts submitted to TETC should be computing focused.

This special issue focuses on covering the most recent research results in scholarly big data management and computing. The issue welcomes both theoretical and applied research (e.g. platforms and applications). It will encourage the effort to share data, advocate gold-standard evaluation among shared data, and promote the exploration of new directions.

Special Issue on Design of Reversible Computing Systems

Submission deadline: March 1, 2018. View PDF.

IEEE Transaction on Emerging Topics in Computing (TETC) seeks original manuscripts for a Special Issue/Section on Design of Reversible Computing Systems scheduled to appear in the first issue of 2019.

Over the coming decade, the historical trend of exponentially-increasing computer performance for systems at a given cost level is expected to slow, as conventional digital technology approaches practical limits to its computational energy efficiency, which in turn limits system performance within any given power and cooling constraints. In the long term, due to fundamental connections between thermodynamics and information theory, the only possible way to continue improving the energy-efficiency and affordable performance of computing systems indefinitely is if their designs increasingly thoroughly apply reversible computing principles. However, the question of exactly how to design practical, cost-competitive reversible computing systems is an extremely challenging engineering problem, which today still remains far from being fully solved. To overhaul the existing industrial infrastructure of manufacturing processes, design tools and software in all of the ways that will likely be needed to fully realize the potential of this unconventional but essential new computing paradigm will arguably require a multi-billion-dollar sustained investment in associated research and development activities. We cannot assume this investment will be made until the research community builds a sufficiently solid case showing that workable implementation approaches exist and are economically feasible. It is the goal of this special issue to solicit high-quality contributions across all levels of computing that pointedly address the crucial issues in the theory, design, and engineering analysis of reversible computing systems, so as to eliminate all of the remaining conceptual roadblocks that impede investment, and establish that the reversible computing paradigm indeed provides a viable path forwards, towards an unbounded new future for computing.


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