Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon
DEC 28, 2016 16:45 PM
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Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon

Thermal Safe Power (TSP): Efficient Power Budgeting for Heterogeneous Manycore Systems in Dark Silicon

Santiago Pagani, Chair for Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
Heba Khdr, Chair for Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
Jian-Jia Chen, Department of Informatics, TU Dortmund, Dortmund, Germany
Muhammad Shafique, Chair for Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
Minming Li, Department of Computer Science, City University of Hong Kong (CityU), Hong Kong, China
Jorg Henkel, Chair for Embedded Systems (CES), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany

Chip manufacturers provide the Thermal Design Power (TDP) for a specific chip. The cooling solution is designed to dissipate this power level. But because TDP is not necessarily the maximum power that can be applied, chips are operated with Dynamic Thermal Management (DTM) techniques. To avoid excessive triggers of DTM, usually, system designers also use TDP as power constraint. However, using a single and constant value as power constraint, e.g., TDP, can result in significant performance losses in homogeneous and heterogeneous manycore systems.

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