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COMPSAC Symposia

SETA: Software Engineering Technologies & Applications

CFP: pdf

SETA Symposium Co-Chairs

Hong Zhu, Oxford Brookes University, UK
Ricky Chan, City University of Hong Kong, Hong Kong

SETA Symposium PC Chairs

Hridesh Rajan, Iowa State University, USA
Alexander Bolotov, University of Westminster, UK
Chang Xu, Nanjing University, China

The Software Engineering Technology and Applications (SETA) symposium is the flagship IEEE symposium on software engineering technologies, and an integral part of the IEEE COMPSAC conference. We invite submissions of high quality research papers that describe original, unpublished work on any topic related to software engineering technology including but not limited to empirical and theoretical work on software engineering, conventional software engineering and also work on emerging topics.

Authors are invited to submit original, unpublished work presenting research and novel computer applications in full-paper format (10 pages, inclusive of figures, tables, appendices, etc). The review and selection process for submissions is designed to identify papers that break new ground and provide substantial support for their results and conclusions as significant contributions to the field. Submissions will be selected that represent a major advancement in the subject of the symposia. At least one author of each accepted paper is required to register to the conference and to present the paper in person at the conference.

Please note that SETA submissions should also follow policies from the COMPSAC conference (e.g., plagiarism). Simultaneous submission to other publication venues is not permitted except as highlighted on the Journal Publishing Opportunities page. Accepted papers may be invited to prestigious journals (e.g., IEEE Transactions on Services Computing, Journal of Systems and Software, and Computer Communications) for extension after consideration from the COMPSAC conference.

Program Committee

Rui Abreu, University of Porto, Portugal
Nimanthi Atukorala, Iowa State University, USA
Alexander Bolotov, University of Westminster, UK
Doo-Hwan Bae, KAIST, South Korea
Xiaoying Bai, Tsinghua University, China
Yan Cai, Chinese Academy of Sciences, China
Chun Cao, Nanjing University, China
Walter Cazzola, Università degli Studi di Milano, Italy
Xing Chen, Fuzhou University, China
Xiangping Chen, Sun Yat-sen University, China
Zhenyu Chen, Nanjing University, China
Ruzanna Chitchyan, University of Leicester, UK
Ivica Crnkovic, Chalmers University of Technology, Sweden
Arilo Claudio Dias-Neto, Federal University of Amazonas, Brazil
Mohammad A. Darvish-Darab, Jacksonville University, USA
Wensheng Dou, Chinese Academy of Sciences, China
Barbara Gallina, Mälardalen University, Sweden
Apala Guha, IIIT Hyderabad, India
Robert Harmon
Xudong He, Florida International University, USA
Hata Hideaki, Nara Institute of Science & Technology, Japan
Bo Jiang, Beihang University, China
George Kakarontzas, Technological Educational Institute of Thessaly, Greece
Jacky Keung, City University of Hong Kong, China
Raffi Khatchadourian, City University of New York, USA
Takashi Kitamura, National Institute of Advanced Industrial Science & Technology (AIST), Japan
Xuansong Li, Nanjing University of Science & Technology, China
Huai Liu, RMIT University, Australia
Jigang Liu, Metropolitan State University, USA
Yepang Liu, The Hong Kong University of Science & Technology, Hong Kong
Lunjin Lu, Oakland University, USA
Jun Ma, Nanjing University, China
Xiaoguang Mao, National University of Defense, China
Hua Ming, Oakland University, USA
Osamu Mizuno, Kyoto Institute of Technology, Japan
Supratik Mukhopadhyay, Louisiana State University, USA
Hiroyuki Okamura, Hiroshima University, Japan
Rocco Oliveto, University of Molise, Italy
Xin Peng, Fudan University, China
Raul Purandare, Indraprastha Institute of Information Technology, Delhi, India
Gwen Salaun, University of Grenoble Alpes, France
Toshifusa Sekizawa, Nihon University, Japan
Sergio Soares, Federal University of Pernambuco (CIn/UFPE), Brazil
Hui Song, SINTEF ICT, Norway
Michiharu Takemoto, NTT Corporation, Japan
Dave Towey, The University of Nottingham at Ningbo, China
T.H. Tse, The University of Hong Kong, Hong Kong
Qianxiang Wang, Peking University, China
Gemma Webster, Edinburgh Napier University, UK
Eric Wong, UT Dallas, USA
Franz Wotawa, TU Graz, Institute for Software Technology, Austria
Xiaoyuan Xie, Wuhan University, China
Jing Xu, Nankai University, Tianjin, China
Sugiyama Yasuhiro, Nihon University, Japan
Chunyang Ye, Hainan University, China
Weider Yu, San Jose State University, USA
Yuen Tak Yu, City University of Hong Kong, Hong Kong
Lingming Zhang, UT Dallas, USA
Yu Zhou, Nanjing University of Aeronautics and Astronautics, China
Zhiquan Zhou, University of Wollongong, Australia
Hong Zhu, Oxford Brookes University, UK



 

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Author Instructions

COMPSAC follows a double blind review process. Please see our sample paper for instructions, and download the appropriate manuscript template from IEEE:  IEEE manuscript templates

Please note COMPSAC C1J2 & J1C2 schemes for journal publication opportunity

Important Dates

October 15, 2016 Extended: October 31, 2016: Workshop Proposals Due

November 15, 2016 Extended: November 30, 2016: Workshop Proposal Notification 

January 13, 2017: ***January 31, 2017, 11:59pm US Pacific Time: Main Conference Papers Due 

March 27, 2017: Main Conference Notification 

April 10, 2017: Workshop Papers Due 

April 25, 2017: Workshop Paper Notification 

May 9, 2017: Camera Ready and Registration Due