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Researchers Create New Method for Chip Printing

Palo Alto Research Center (PARC) researchers—with the US National Science Foundation and DARPA—designed a laser printer-like machine able to properly and precisely place tens or even hundreds of thousands of tiny chips on a surface, which could eventually eliminate the need for circuit boards and specialized assembly processes. These tiny circuits could be any component needed to make a computer, smart objects, or other systems such as MEMS. Known as Xerographic micro-assembly, the process uses silicon wafers that are broken into tens of thousands of chiplets. These are used as “ink” in the printing process, which the researchers compare to the process of a Xerox laser printer putting toner on paper. The PARC researchers say this is the first step toward such a commercial chip-printing system. (SlashDot)(The New York Times)

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