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Researchers Developing Heat Management for 3D Chips

The heat generated in  3D integrated circuits creates a new challenge for device designers, but researchers from the University of Texas Arlington are working on a method to minimize and dissipate the heat before it can affect performance or damage the chip. They are investigating the properties of materials used in creating 3D integrated circuits and Through-Silicon Vias, which the circuits use for communicating instructions throughout the chip, to create an effective heat-management strategy. The research is being funded by the National Science Foundation and supported by IBM. (PhysOrg)(University of Texas Arlington)

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