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Issue No. 03 - May-June (2017 vol. 14)
ISSN: 1545-5971
pp: 237-248
Zhe Liu , College of Computer Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China
Xinyi Huang , Fujian Normal University, Fuzhou, P.R. China
Zhi Hu , School of Mathematics and Statistics, Central South University, Changsha, Hunan, P.R. China
Muhammad Khurram Khan , Center of Excellence in Information Assurance, King Saud University, Riyadh, Kingdom of Saudi Arabia
Hwajeong Seo , Institute for Infocomm Research (I2R), Singapore, Singapore
Lu Zhou , Security and Trust (SnT), University of Luxembourg, Luxembourg
Lightweight Elliptic Curve Cryptography (ECC) is a critical component for constructing the security system of Internet of Things (IoT). In this paper, we define an emerging family of lightweight elliptic curves to meet the requirements on some resource-constrained devices. We present the design of a scalable, regular, and highly-optimized ECC library for both MICAz and Tmote Sky nodes, which supports both widely-used key exchange and signature schemes. Our parameterized implementation of elliptic curve group arithmetic supports pseudo-Mersenne prime fields at different security levels with two optimized-specific designs: the high-speed version (HS) and the memory-efficient (ME) version. The former design achieves record times for computation of cryptographic schemes at roughly $_$80\sim 128$_$ -bit security levels, while the latter implementation only requires half of the code size of the current best implementation. We also describe our efforts to evaluate the energy consumption and harden our library against some basic side-channel attacks, e.g., timing attacks and simple power analysis (SPA) attacks.
Elliptic curves, Internet of things, Elliptic curve cryptography, Wireless sensor networks, Electronic mail

Z. Liu, X. Huang, Z. Hu, M. K. Khan, H. Seo and L. Zhou, "On Emerging Family of Elliptic Curves to Secure Internet of Things: ECC Comes of Age," in IEEE Transactions on Dependable and Secure Computing, vol. 14, no. 3, pp. 237-248, 2017.
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