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<p><b>Abstract</b>—A high performance, programmable, floating point multiprocessor architecture has been specifically designed to exploit advanced two- and three-dimensional hybrid wafer scale packaging to achieve low size, weight, and power, and improve reliability for embedded systems applications. Processing elements comprised of a 0.8 micron CMOS dual processor chip and commercial synchronous SRAMs achieve more than 100 MFLOPS/Watt. This power efficiency allows up to 32 processing elements to be incorporated into a single 3D multichip module, eliminating multiple discrete packages and thousands of wirebonds. The dual processor chip can dynamically switch between independent processing, watchdog checking, and coprocessing modes. A flat, SRAM memory provides predictable instruction set timing and independent and accurate performance prediction.</p>
Computer reliability, embedded processing, wafer scale integration, parallel architectures, memory hierarchies, high-speed integrated circuits.
Mark H. Linderman, Richard W. Linderman, Ralph L.R. Kohler, "A Dependable High Performance Wafer Scale Architecture for Embedded Signal Processing", IEEE Transactions on Computers, vol. 47, no. , pp. 125-128, January 1998, doi:10.1109/12.656096
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