Parallel Computing in Electrical Engineering, 2004. International Conference on (2004)
Sept. 7, 2004 to Sept. 10, 2004
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/PCEE.2004.59
Torsten Mehlan , Chemnitz University of Technology, Germany
Wolfgang Rehm , Chemnitz University of Technology, Germany
Ralph Engler , Chemnitz University of Technology, Germany
Tobias Wenzel , Chemnitz University of Technology, Germany
The Virtual Interface Architecture (VIA) was introduced to define a common set of features that are suitable to build high-speed networks. Today the interface of VIA serves as access point to a wide range of system area networks. M-VIA is a software that provides the VIA interface on top of several Ethernet cards. The overhead of TCP/IP protocols is avoided by running M-VIA. To benefit from this performance we developed a LAM/MPI module that utilizes VIA functions to transmit data. The key concepts of data transmission and memory management are presented by this paper. Furthermore a comparative performance analysis is included.
T. Wenzel, T. Mehlan, R. Engler and W. Rehm, "Providing a High-Performance VIA-Module for LAM/MPI," Parallel Computing in Electrical Engineering, 2004. International Conference on(PARELEC), Dresden, Germany, 2004, pp. 277-282.