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Parallel Computing in Electrical Engineering, 2004. International Conference on (2004)
Dresden, Germany
Sept. 7, 2004 to Sept. 10, 2004
ISBN: 0-7695-2080-4
pp: 277-282
Torsten Mehlan , Chemnitz University of Technology, Germany
Wolfgang Rehm , Chemnitz University of Technology, Germany
Ralph Engler , Chemnitz University of Technology, Germany
Tobias Wenzel , Chemnitz University of Technology, Germany
ABSTRACT
The Virtual Interface Architecture (VIA) was introduced to define a common set of features that are suitable to build high-speed networks. Today the interface of VIA serves as access point to a wide range of system area networks. M-VIA is a software that provides the VIA interface on top of several Ethernet cards. The overhead of TCP/IP protocols is avoided by running M-VIA. To benefit from this performance we developed a LAM/MPI module that utilizes VIA functions to transmit data. The key concepts of data transmission and memory management are presented by this paper. Furthermore a comparative performance analysis is included.
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CITATION
Torsten Mehlan, Wolfgang Rehm, Ralph Engler, Tobias Wenzel, "Providing a High-Performance VIA-Module for LAM/MPI", Parallel Computing in Electrical Engineering, 2004. International Conference on, vol. 00, no. , pp. 277-282, 2004, doi:10.1109/PCEE.2004.59
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