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Proceedings of the 22nd International Conference on Parallel Architectures and Compilation Techniques (2013)
Edinburgh, United Kingdom United Kingdom
Sept. 7, 2013 to Sept. 11, 2013
ISSN: 1089-795X
ISBN: 978-1-4799-1018-2
pp: xii
Filippo Sironi , Politecnico di Milano, Milano, Italy
Martina Maggio , Lund University, Lund, Sweden
Riccardo Cattaneo , Politecnico di Milano, Milano, Italy
Giovanni Francesco Del Nero , Politecnico di Milano, Milano, Italy
Donatella Sciuto , Politecnico di Milano, Milano, Italy
Marco Domenico Santambrogio , Politecnico di Milano, Milano, Italy
ABSTRACT

Constraining the temperature of computing systems has become a dominant aspect in the design of integrated circuits. The supply voltage decrease has lost its pace even though the feature size is shrinking constantly. This results in an increased number of transistors per unit of area and hence a growing power density. Researchers started investigating dynamic thermal management techniques to address the trade-off between performance and temperature. Hardware dynamic thermal management can guarantee safety but, at the same time, can negatively affect established service-level agreements. On the other hand, software solutions rely on hardware for safety but does not indiscriminately trade-off performance for temperature.

We propose ThermOS, an extension for commodity operating systems that harnesses formal feedback control and idle cycle injection to decrease thermal emergencies while showing better efficiency than commodity and cutting edge techniques.

INDEX TERMS
operating system, CMP, DTM, OS, chip multi-processor, chip-multiprocessor, dynamic thermal management, multi-core, multicore
CITATION
Filippo Sironi, Martina Maggio, Riccardo Cattaneo, Giovanni Francesco Del Nero, Donatella Sciuto, Marco Domenico Santambrogio, "ThermOS: system support for dynamic thermal management of chip multi-processors", Proceedings of the 22nd International Conference on Parallel Architectures and Compilation Techniques, vol. 00, no. , pp. xii, 2013, doi:10.1109/PACT.2013.6618795
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