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Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (1997)
Nagoya, Japan
Jan. 26, 1997 to Jan. 30, 1997
ISSN: 1084-6999
ISBN: 0-7803-3744-1
TABLE OF CONTENTS

A decade of MEMS and its future (PDF)

H. Fujita , Inst. of Ind. Sci., Tokyo Univ., Japan
pp. 1-7

Grand in purpose insignificant in size (PDF)

W. Trimmer , Belle Mead Res., NJ, USA
pp. 9-13

Miniaturized chemical analysis systems based on electroosmotic flow (PDF)

A. Manz , Dept. of Chem., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 14-18

Integrated micro-laser displacement sensor (PDF)

R. Sawada , NTT Opto-Electron. Labs., Ibaraki, Japan
pp. 19-24

High-order micromechanical electronic filters (PDF)

K. Wang , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 25-30

Near field optics for nanometric sensing and control (PDF)

S. Kawata , Dept. of Appl. Phys., Osaka Univ., Japan
pp. 37-42

Microactuated micro-XYZ stages for free-space micro-optical bench (PDF)

L.Y. Lin , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 43-48

Micro-electro-mechanical variable blaze gratings (PDF)

D.M. Burns , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 55-60

Hexsil tweezers for teleoperated micro-assembly (PDF)

C.G. Keller , Dept. of Mater. Sci. & Miner. Eng., California Univ., Berkeley, CA, USA
pp. 72-77

The first valve-less diffuser gas pump (PDF)

A. Olsson , Dept. of Signals, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden
pp. 108-113

A MEMS thermopneumatic silicone membrane valve (PDF)

X. Yang , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 114-118

Micromachined electrical field-flow fractionation (/spl mu/-EFFF) system (PDF)

B.K. Gale , Dept. of Bioeng., Utah Univ., Salt Lake City, UT, USA
pp. 119-124

Self-supported Si fabrication of with STM nano-structure (PDF)

H. Hamanaka , Fac. of Eng., Tohoku Univ., Sendai, Japan
pp. 153-158

Si nano-wire SPM probe grown by field evaporation with UHV STM (PDF)

T. Ono , Fac. of Eng., Tohoku Univ., Sendai, Japan
pp. 159-164

3C-SiC coating of silicon micromachined atomizers (PDF)

N. Rajan , Microfabrication Lab., Case Western Reserve Univ., Cleveland, OH, USA
pp. 165-168

Glass direct bonding technology for hermetic seal package (PDF)

D. Ando , Corporate Components Dev. Centre, Matsushita Electron. Components Co. Ltd., Osaka, Japan
pp. 186-190

Microriveting-a new wafer joining method (PDF)

B. Shivkumar , Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
pp. 197-202

Flip-chip packaging for thermal CMOS anemometers (PDF)

F. Mayer , Lab. of Phys. Electron., Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 203-208

Assembling process for microscopic components using magnetic force (PDF)

H. Ota , Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
pp. 209-214

Surface micromachined linear electrostatic stepper motor (PDF)

N.R. Tas , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 215-220

Mechanical coupling and direct torque measurement of outer-rotor polysilicon micromotors (PDF)

K.C. Stark , Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
pp. 221-226

Micro electrostatic wobble motor with toothed electrodes (PDF)

K. Suzumori , Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 227-232

A proportional microvalve using a bi-stable magnetic actuator (PDF)

Y. Shinozawa , Frontier Technol. Res. Inst., Tokyo Gas Co. Ltd., Japan
pp. 233-237

Evaluation of a surface acoustic wave motor output force (PDF)

M. Chiba , Dept. of Precision Machinery Eng., Tokyo Univ., Japan
pp. 250-255

Stress-optimised shape memory microvalves (PDF)

K.D. Skrobanek , IMT, Forschungszentrum Karlsruhe GmbH, Karlsruhe, Germany
pp. 256-261

A laser-powered micro-gripper (PDF)

W. Nogimori , Electron. Field, AISIN-COSMOS R&D Co. Ltd., Aichi, Japan
pp. 267-271

A CMOS-compatible device for fluid density measurements (PDF)

D. Westberg , Dept. of Solid State Electron., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 278-283

Touch mode capacitive pressure sensors for industrial applications (PDF)

W.H. Ko , Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
pp. 284-289

Pull-in time dynamics as a measure of absolute pressure (PDF)

R.K. Gupta , Microsyst. Technol. Lab., MIT, Cambridge, MA, USA
pp. 290-294

Valve-less diffuser micropumps fabricated using thermoplastic replication (PDF)

A. Olsson , Dept. of Signals, Sensors and Syst., R. Inst. of Technol., Stockholm, Sweden
pp. 305-310

Microfluidic plastic capillaries on silicon substrates: a new inexpensive technology for bioanalysis chips (PDF)

P.F. Man , Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
pp. 311-316

Microvalve with ultra-low leakage (PDF)

M. Hirano , NTT Integrated Inf. & Energy Syst. Labs., Tokyo, Japan
pp. 323-326

Optical communication using micro corner cube reflectors (PDF)

P.B. Chu , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 350-355

Optical properties of a Si binary optic microlens for infrared ray (PDF)

K. Fujikawa , Matsusita Electron. Components Co. Ltd., Osaka, Japan
pp. 360-365

Invar MEMS milliactuator for hard disk drive application (PDF)

T. Hirano , Res. Div., IBM Almaden Res. Center, San Jose, CA, USA
pp. 378-382

A new pick up and release method by heating for micromanipulation (PDF)

F. Arai , Dept. of Micro Syst. Eng., Nagoya Univ., Japan
pp. 383-388

A new MEMS wafer probe card (Abstract)

Yanwei Zhang , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 395-399

Superlubricity mechanism for micro electro mechanical systems (PDF)

M. Hirano , NTT Integrated Inf. & Energy Syst. Labs., Tokyo, Japan
pp. 436-441

Comparative study of various release methods for polysilicon surface micromachining (PDF)

J.Y. Kim , Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
pp. 442-447

Gas-phase etching of sacrificial oxides using anhydrous HF and CH/sub 3/OH (PDF)

Jong Hyun Lee , Semicond. Technol. Div., Electron. & Telecommun. Res. Inst., Taejon, South Korea
pp. 448-453

Angular micropositioner for disk drives (PDF)

D.A. Horsley , Sensor & Actuator Center, California Univ., Berkeley, CA, USA
pp. 454-459

Gas tightness of cavities sealed by silicon wafer bonding (PDF)

S. Mack , Max-Planck-Inst. of Microstructure Phys., Halle, Germany
pp. 488-493

Integrated micromachined decoupled CMOS chip on chip (PDF)

M. Schneider , Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 512-517

Sacrificial aluminum etching for CMOS microstructures (PDF)

O. Paul , Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 523-528

LIGA-microtesting system with integrated strain gauges for force measurement (PDF)

P. Ruther , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 541-545
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