The Community for Technology Leaders
Multi-Chip Module Conference, IEEE (1997)
Santa Cruz, CA
Feb. 4, 1997 to Feb. 5, 1997
ISBN: 0-8186-7789-9
TABLE OF CONTENTS

Foreword (PDF)

pp. viii
SESSION I: Flip-Chip I: Moderator: Don Bouldin, University of Tennessee

Area I/O Flip-Chip Packaging to Minimize Interconnect Length (Abstract)

Richard B. Brown , The University of Michigan, Ann Arbor
Mini Nanua , The University of Michigan, Ann Arbor
Timothy D. Strong , The University of Michigan, Ann Arbor
Ronald J. Lomax , The University of Michigan, Ann Arbor
pp. 2

Determination of Area-Array Bond Pitch for Optimum MCM Systems: A Case Study (Abstract)

P. Dehkordi , Tennessee Univ., Knoxville, TN, USA
H. Davidson , Tennessee Univ., Knoxville, TN, USA
D. Bouldin , Tennessee Univ., Knoxville, TN, USA
K. Ramamurthi , Tennessee Univ., Knoxville, TN, USA
pp. 8

A Flip-Chip Implementation of the Data Encryption Standard (DES) (Abstract)

Srisai Rao , North Carolina State University, Raleigh, NC
Alan Glaser , North Carolina State University, Raleigh, NC
Paul Franzon , North Carolina State University, Raleigh, NC
Toby Schaffer , North Carolina State University, Raleigh, NC
pp. 13
SESSION II: Mixed Signal MCMs: Moderator: Peter Ivei, University of Sheffield

An 8-Bit 2.5 Gigasample A/D Converter Multichip Module for All-Digital Radar Receiver for AN/APS 145 Radar on Navy E2-C Airborne Early Warning Aircraft (Abstract)

P.J. Riemer , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
B.K. Gilbert , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
R.L. Thompson , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
E.L.H. Amundsen , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
M.J. Degerstrom , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
W.L. Walters , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
M.E. Vickberg , Special Purpose Process. Dev. Group, Mayo Found., Rochester, MN, USA
pp. 20

The Impact of Miniaturization and Passive Component Integration in Emerging MCM Applications (Abstract)

Yee L. Low , Bell Laboratories, Lucent Technologies
Robert C. Frye , Bell Laboratories, Lucent Technologies
pp. 27

High Q Inductors for MCM-Si Technology (Abstract)

J. Hartung , Ericsson Res. & Dev., Research Triangle Park, NC, USA
N. Klemmer , Ericsson Res. & Dev., Research Triangle Park, NC, USA
pp. 33

Investigations on Novel Coaxial Transmission Line Structures on MCM-L (Abstract)

Claus Habiger , Electronics Laboratory, ETH Zuerich
Gerhard Troester , Electronics Laboratory, ETH Zuerich
Andreas Thiel , Electronics Laboratory, ETH Zuerich
pp. 38

Precision Embedded Thin Film Resistors for Multichip Modules (MCM-D) (Abstract)

D. Tuckerman , nCHIP Inc., San Jose, CA, USA
C.-M. Lin , nCHIP Inc., San Jose, CA, USA
E.A. Logan , nCHIP Inc., San Jose, CA, USA
pp. 44
SESSION III: MCM Design and CAD: Moderator: Wayne Dai, University of California, Santa Cruz

High Speed I./O Buffer for MCM (Abstract)

K.L. Tai , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.C. Frye , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
S. J. Yang , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
T.C. Chang , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
R.-W. Chien , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
T. J. Gabara , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
E.D. Wang , Electron. Res. & Service Organ., Ind. Technol. Res. Inst., Hsinchu, Taiwan
pp. 52

Wire Length and Width Bound Generation for High-Speed MCM and PCB Designs (Abstract)

E. Shragowitz , Quad Design Technol., Camarillo, CA, USA
J. Lee , Quad Design Technol., Camarillo, CA, USA
H. Chen , Quad Design Technol., Camarillo, CA, USA
pp. 58

An Adaptive Wide-Area Design Process Manager for Collaborative Multichip Module Design (Abstract)

A.M. Madni , Intelligent Syst. Technol. Inc., USA
C.C. Madni , Intelligent Syst. Technol. Inc., USA
pp. 63

Multiscale Thermal Design of MCMs with High Resolution Unstructured Adaptive Simulation Tools (Abstract)

Z.Q. Tan , CFD Res. Corp., Huntsville, AL, USA
A. J. Przekwas , CFD Res. Corp., Huntsville, AL, USA
Y. Jiang , CFD Res. Corp., Huntsville, AL, USA
pp. 73

A New Timing-Driven Multilayer MCM/IC Routing Algorithm (Abstract)

Ernest S. Kuh , University of California, Berkeley, CA, USA
Dongsheng Wang , University of California, Berkeley, CA, USA
pp. 89
SESSION IV:
SESSION V: Interconnect Analysis and Simulation: Moderator: S. Muddhu, Silicon Graphics

Fast Extraction of the Capacitance Matrix of Multilayered Multiconductor Interconnects Using the Method of Lines (Abstract)

Wei Hong , University of California, Santa Cruz, CA, USA
Xiaohong Jiang , Ecole Polytechnique de Montreal, Montreal, Canada
Ke Wu , Ecole Polytechnique de Montreal, Montreal, Canada
Wayne Wei-Ming Dai , University of California, Santa Cruz, CA, USA
pp. 98

Delay Models for MCM Interconnects when Response is Non-Monotone (Abstract)

Andrew B. Kahng , University of California, Los Angeles, California, USA
Sudhakar Muddu , MIPS Technologies, Silicon Graphics, Inc., California, USA
Kei Masuko , University of California, Los Angeles, California, USA
pp. 102

S Parameter-Based Experimental Modeling of High Q MCM Inductor with Exponential Gradient Learning Algorithm (Abstract)

King L. Tai , Lucent Technologies Bell Labs, New Jersey, USA
Robert C. Frye , Lucent Technologies Bell Labs, New Jersey, USA
Jinsong Zhao , University of California Santa Cruz, California, USA
Wayne Dai , University of California Santa Cruz, California, USA
pp. 108

Modeling the Frequency-Dependent Parameters of High-Speed Interconnects: A Neural Network Approach (Abstract)

Michel S. Nakhla , Carleton University, Ottawa, Canada
Qi-jun Zhang , Carleton University, Ottawa, Canada
Anand Veluswami , Mite1 Corp., Kanata, Canada
pp. 114
SESSION VI: Flip-Chip II: Moderator: Peter Ivey, University of Shemeld

Intrinsic Area Array ICs: What, Why, and How? (Abstract)

Chandra Tan , The University of Tennessee, Tennessee, USA
Peyman Dehkordi , The University of Tennessee, Tennessee, USA
Donald Bouldin , The University of Tennessee, Tennessee, USA
pp. 120

CAD Tools for Area-Distributed I/O Pad Packaging (Abstract)

Xiaowen Liu , Cascade Design Automation, WA, USA
Phiroze Parakh , The University of Michigan, MI, USA
Richard Brown , The University of Michigan, MI, USA
Mark Rossman , Cascade Design Automation, WA, USA
Todd Basso , The University of Michigan, MI, USA
Ray Farbarik , Cascade Design Automation, WA, USA
pp. 125

Flexible Manufacturing of Multichip Modules for Flip Chip ICs (Abstract)

G. Caldwell , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
B. Lunceford , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
J. Reed , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
D. Cobb , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
R. Miracky , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
M. Wang , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
I. Yee , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
pp. 130

Prototype Development of Flip Chip MCMs (Abstract)

S. Lipa , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
P. Franzon , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
J. Schaeffer , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
W. Hansford , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
J. Peltier , Inf. Sci. Inst., Univ. of Southern California, Marina del Rey, CA, USA
pp. 133
SESSION VII: Test, Technology and Infrasitructure: Moderator: Chung Ho, Micromodule Systems

Low Cost Test of MCMs Using Testable Die Carriers (Abstract)

K. Sasidhar , Packaging Research Center Georgia Institute of Technology
M. Swaminathan , Packaging Research Center Georgia Institute of Technology
A. Chatterjee , Packaging Research Center Georgia Institute of Technology
pp. 138

Comparative Cost Analysis for Smart-Substrate MCM Systems (Abstract)

Hubert Werkmann , Institute for Microelectronics Stuttgart
Bernd Hufflinger , Institute for Microelectronics Stuttgart
pp. 150
SESSION VIII: Optical MCMs: Moderator: Paul Kohl, Georgia Tech

Design of ICs for Flip-Chip Integration with Optoelectronic Device Arrays (Abstract)

R. Farbarik , North Carolina Univ., Charlotte, NC, USA
A. Krishnamoorthy , North Carolina Univ., Charlotte, NC, USA
J. Rieve , North Carolina Univ., Charlotte, NC, USA
F. Kiamilev , North Carolina Univ., Charlotte, NC, USA
C. Hull , North Carolina Univ., Charlotte, NC, USA
R. Oettel , North Carolina Univ., Charlotte, NC, USA
G. Aplin , North Carolina Univ., Charlotte, NC, USA
R. Rosier , North Carolina Univ., Charlotte, NC, USA
pp. 163
SESSION IX: Wrap Up Panel: Organizer and Moderator: Steve Leanheart, GTE

Author Index (PDF)

pp. 171
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