The Community for Technology Leaders
Multi-Chip Module Conference, IEEE (1996)
Santa Cruz, CA
Feb. 6, 1996 to Feb. 7, 1996
ISBN: 0-8186-7286-2
TABLE OF CONTENTS

Foreword (PDF)

pp. ix
Keynote Address

The Role of MCMs in Wireless Communications (Abstract)

W.D. Baker , Wireless Access Inc., USA
pp. 0002
Discussion Session I: Infrastructure Issues
Session II: New MCM Applications

A Multichip Module Solution for High-Performance ATM Switching (Abstract)

F. Martin , IBM Montpellier Technologies
L. Pilati , CSELT, Centro Studi e Laboratori Telecomunicazioni
M. Peretti , CSELT, Centro Studi e Laboratori Telecomunicazioni
J.J. Ichai , IBM Montpellier Technologies
P.Y. Urena , IBM Montpellier Technologies
L. Licciardi , CSELT, Centro Studi e Laboratori Telecomunicazioni
pp. 0010

A Multichip Module, the Basic Building Block for Large Area Pixel Detectors (Abstract)

L. Scharfetter , University of Wuppertal
K.-H. Becks , University of Wuppertal
E.H.M. Heijne , University of Wuppertal
W. Snoeys , University of Wuppertal
P. Middelkamp , University of Wuppertal
pp. 0016

Space-Cube: A Flexible Computer Architecture Based on Stacked Modules (Abstract)

G. Bolotin , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 0020
Session III: Flip-Chip MCMs

Flip Chip Overview (Abstract)

P.A. Magill , MCNC, Research Triangle Park, NC, USA
G.A. Rinne , MCNC, Research Triangle Park, NC, USA
P.A. Deane , MCNC, Research Triangle Park, NC, USA
J.D. Mis , MCNC, Research Triangle Park, NC, USA
pp. 0028

An Approach to the Low Cost Flip-Chip Technology Development with Punched-Out Solder Disks by Micro-Press Punching Method (Abstract)

Yoshimasa Katou , NEC Corporation, Production Material Engineering Laboratories
Masamoto Tago , NEC Corporation, Production Material Engineering Laboratories
Manabu Bonkohara , NEC Corporation, Production Material Engineering Laboratories
Ikushi Morisaki , NEC Corporation, Production Material Engineering Laboratories
Hirofumi Nakamura , NEC Corporation, Production Material Engineering Laboratories
Akihiro Dohya , NEC Corporation, Production Material Engineering Laboratories
pp. 0034

Fluxless Flip-Chip for Multichip Modules (Abstract)

Elizabeth A. Logan , nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
Belinda S. Fernandez , nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
Julia L. F. Goldstein , nCHIP, Inc., 1971 N. Capitol Avenue, San Jose, CA 95132 USA
pp. 0039

Thermal Performance Characteristics Comparison Between Flip-Chip and Wirebond Ceramic Multichip Modules (Abstract)

T. D. Yuan , IBM Microelectronics, 1580 route 52, MS 81A , Hopewell Junction, New York 12533
pp. 0044
Session IV: Mixed-Signal MCMs

Mixed Signal Digital Sub-Band Tuner Multichip Module (Abstract)

Ken Sienski , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Mark Chivers , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Calvin Field , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
Clint Schreiner , E-Systems, Garland Division, 1200 Jupiter Road, Garland, Texas 75042
pp. 0050

The Application of Silicon-on-Silicon MCMs to Advanced Analog Power Controllers (Abstract)

D. Dromgoole , AT&T Bell Labs., Mesquite, TX, USA
B.J. Han , AT&T Bell Labs., Mesquite, TX, USA
R. Frye , AT&T Bell Labs., Mesquite, TX, USA
K. Tai , AT&T Bell Labs., Mesquite, TX, USA
A. Feygenson , AT&T Bell Labs., Mesquite, TX, USA
A. Lotfi , AT&T Bell Labs., Mesquite, TX, USA
pp. 0055

Integrated Microwave Filters in MCM-D (Abstract)

Eric Beyne , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Philip Pieters , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Steven Brebels , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0061

A High Frequency, High Power Miniature DC to DC Power Supply Utilizing MCM-L Technology (Abstract)

Matt Salatino , Harris Semiconductor, Melbourne, Florida
Greg Miller , Harris Semiconductor, Melbourne, Florida
pp. 0067

A New Multichip-on-Silicon Packaging Scheme with Integrated Passive Components (Abstract)

M. Dutoit , Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
R. Sachot , Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
L. Guerin , Institute for Micro- and Optoelectronics, Swiss Federal Institute of Technology
pp. 0073
Session V: Poster Session

A Cost Analysis Study of Deposited-MCM Active Substrates for Testability Purposes (Abstract)

J. Oliver , CNM Institute, University Autonoma of Barcelona, Spain.
H. Kerkhoff , MESA Institute. University of Twente
pp. 0080

Flexible Access to MCM Technology via the Multichip Module Designers' Access Service (MIDAS) (Abstract)

Wes Hansford , The MIDAS Service, Information Sciences Institute
Jennifer Peltier , The MIDAS Service, Information Sciences Institute
pp. 0086

Development of a DSP/MCM Subsystem Assessing Low-Volume, Low-Cost MCM Prototyping for Universities (Abstract)

Tim Powell , University of Tennessee
Peyman Dehkordi , University of Tennessee
Donald Bouldin , University of Tennessee
pp. 0089

A Fast Method for the Simulation of Lossy Interconnects with Frequency Dependent Parameters (Abstract)

Michel Nakhla , Dept. of Electronics, Carleton University, Ottawa, Canada
Juliusz Poltz , OptEM Engineering Inc., Calgary, Canada
Roni Khazaka , Dept. of Electronics, Carleton University, Ottawa, Canada
Q.J. Zhang , Dept. of Electronics, Carleton University, Ottawa, Canada
pp. 0095

Determination of the Propagation Constant of Coupled Lines on Chips Based on High-Frequency Measurements (Abstract)

Enno Grotelueschen , Laboratorium fuer Informationtechnologie, University of Hannover
Lohit Sagar Dutta , Laboratorium fuer Informationtechnologie, University of Hannover
Thomas-Michael Winkel , Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski , Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0099

Fast Parameters Extraction of Multilayer and Multiconductor Interconnects Using Geometry Independent Measured Equation of Invariance (Abstract)

Wayne Wei-Ming Dai , Board of Studies in Computer Engineering, University of California, Santa Cruz
Weikai Sun , Board of Studies in Computer Engineering, University of California, Santa Cruz
Wei Hong , Board of Studies in Computer Engineering, University of California, Santa Cruz
pp. 0105

An Optimum Pin Redistribution for Multichip Modules (Abstract)

Jun Dong Cho , Dept. of Electr. Eng., Sung Kyun Kwan Univ., Suwon, South Korea
pp. 0111

A Sensitivity-Based Wiresizing Approach to Interconnect Optimization of Lossy Transmission Line Topologies (Abstract)

Tianxiong Xue , EECS Dept., Univ. of CA at Berkeley
Ernest S. Kuh , EECS Dept., Univ. of CA at Berkeley
Qinjian Yu , Dept. of Electrical Engineering, Nanjing University of Science and Technology
pp. 0117

Advanced Interconnected Mesh Power System (IMPS) MCM Topologies (Abstract)

L.W. Schaper , High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
J.P. Parkerson , High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
pp. 0123

Micro-Machined Heat Pipes in Silicon MCM Substrates (Abstract)

R. T. Mitchell , Sandia National Laboratories,
M. R. Tuck , Sandia National Laboratories,
D. R. Adkins , Sandia National Laboratories,
D. W. Palmer , Sandia National Laboratories,
D. A. Benson , Sandia National Laboratories,
pp. 0127
Session VI: Electrical Design

MCM-D Switching Units for Interconnection Technology Validation (Abstract)

Eric Beyne , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Claudio Truzzi , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
Edwin Ringoot , IMEC, Kapeldreef 75, 3001 Leuven, Belgium
pp. 0132

Off-Chip 400MBPS Signal Transmission: Noise Reduction Using Non-Resonant Lengths and Other Techniques (Abstract)

Ron Nikel , Silicon Graphics Inc., Mountain View, CA
Yao-Chao Yang , Silicon Graphics Inc., Mountain View, CA
Heinz Blennemann , Silicon Graphics Inc., Mountain View, CA
pp. 0138

A Functional Module Comparison of the Interconnected Mesh Power System (IMPS) with a Standard Four-Layer MCM Topology (Abstract)

Michael D. Glover , High Density Electronics Center (HiDEC) University of Arkansas
Leonard W. Schaper , High Density Electronics Center (HiDEC) University of Arkansas
pp. 0143
Session VII: Design Optimization

Chip and Package Co-Design Technique for Clock Networks (Abstract)

Qing Zhu , RN5-09, Microprocessor Technology, Intel Corporation, Santa Clara, CA95052
Wayne W.M. Dai , Computer Engineering Department, University of California, Santa Cruz, CA 95064
pp. 0160
Session VIII: Computer-Aided Design

Early System Noise Analysis in Mixed-Signal Silicon-on-Silicon MCM Systems (Abstract)

Wayne W.M. Dai , Computer Engineering Board of Studies, University of California, Santa Cruz
Joe G. Xi , Computer Engineering Board of Studies, University of California, Santa Cruz
pp. 0166

An MCM/IC Timing-Driven Placement Algorithm Featuring Explicit Design Space Exploration (Abstract)

Ernest S. Kuh , University of California, Berkeley, CA
Henrik Esbensen , University of California, Berkeley, CA
pp. 0170
Session IX: Advances in MCM Technology

New Olefinic Interlevel Dielectric Materials for Multi-Chip Modules (Abstract)

N.R. Grove , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
S. Jayaraman , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
P.A. Kohl , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
B.L. Goodall , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
S.A. Bidstrup-Allen , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
R.A. Shick , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
L.H. McIntosh , Adv. Technol. Group, BFGoodrich, Brecksville, OH, USA
pp. 0182
Session X: Modeling of Interconnect

An Accurate Determination of the Characteristic Impedance of Lossy Lines on Chips Based on High Frequency S-Parameter Measurements (Abstract)

Thomas-Michael Winkel , Laboratorium fuer Informationtechnologie, University of Hannover
Hartmut Grabinski , Laboratorium fuer Informationtechnologie, University of Hannover
Lohit Sagar Dutta , Laboratorium fuer Informationtechnologie, University of Hannover
pp. 0190

A New Moment Generation Technique for Interconnects Characterized by Measured or Calculated S-Parameters (Abstract)

M. Celik , University of Arizona
A. Deutsch , Thomas J. Watson Research Center
A.C. Cangellaris , University of Arizona
pp. 0196

Efficient Gate Delay Modeling for Large Interconnect Loads (Abstract)

Sudhakar Muddu , 4651 Boelter Hall, Dept. of CS, UCLA, Los Angeles, CA 90095-1596.
Andrew B. Kahng , 4651 Boelter Hall, Dept. of CS, UCLA, Los Angeles, CA 90095-1596.
pp. 0202

Author Index (PDF)

pp. 0208
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