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2013 IEEE International Test Conference (ITC) (2011)
Anaheim, CA USA
Sept. 20, 2011 to Sept. 22, 2011
ISSN: 1089-3539
ISBN: 978-1-4577-0153-5
TABLE OF CONTENTS

Test cost reduction through performance prediction using virtual probe (Abstract)

Hsiu-Ming Chang , Univ. of California, Santa Barbara, CA, USA
Kwang-Ting Cheng , Univ. of California, Santa Barbara, CA, USA
Wangyang Zhang , Carnegie Mellon Univ., Pittsburgh, PA, USA
Xin Li , Carnegie Mellon Univ., Pittsburgh, PA, USA
K. M. Butler , Texas Instrum., Dallas, TX, USA
pp. 1-9

Physically-aware analysis of systematic defects in integrated circuits (Abstract)

Wing Chiu Tam , ECE Dept., Carnegie Mellon Univ., Pittsburgh, PA, USA
R. D. Blanton , ECE Dept., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1-10

Wafer probe test cost reduction of an RF/A device by automatic testset minimization — A case study (Abstract)

Dragoljub Drmanac , Univ. of California, Santa Barbara, CA, USA
Li C. Wang , Univ. of California, Santa Barbara, CA, USA
pp. 1-10
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