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Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270) (1998)
Washington, D.C. USA
Oct. 18, 1998 to Oct. 23, 1998
ISSN: 1089-3539
ISBN: 0-7803-5093-6
pp: 109
Andreas C. Pfahnl , Kinetrix, Inc.
John H. Lienhard V , Massachusetts Institute of Technology
Alexander H. Slocum , Massachusetts Institute of Technology
ABSTRACT
A new design feature of an integrated circuit (IC) test handler tray is described that significantly improves the convective heat transfer to the tray and the IC devices in the tray. The improved tray incorporates vertically protruding ribs which breakup thermal boundary layers and enhance mixing. High-speed, tray-based handlers can consequently warm or cool trays of devices at substantially faster rates. Design equations for the tray ribs are verified through experimental testing and provide a means to predict the warm-up or cool-down times of the tray and devices.
INDEX TERMS
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CITATION

A. H. Slocum, J. H. Lienhard V and A. C. Pfahnl, "MAXIMIZING HANDLER THERMAL THROUGHPUT WITH A RIB-ROUGHENED TEST TRAY," Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270)(ITC), Washington, D.C. USA, 1998, pp. 109.
doi:10.1109/TEST.1998.743143
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