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Ninth IEEE International Symposium on Wearable Computers (ISWC'05) (2005)
Osaka, Japan
Oct. 18, 2005 to Oct. 21, 2005
ISBN: 0-7695-2419-2
pp: 204-205
Jaana Htinnikainen , Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND
Jussi Mikkonen , Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND
Jukka Vanhala , Tampere University of Technology/Institute of Electronics Korkeakoulunkatu 3, P.O. Box 692,FIN-33 720 Tampere, FINLAND
ABSTRACT
<p>This paper describes a novel bulfon component encasing for wearable technology applications. The button covers the electronics inside and forms a galvanic contact for communications between the hard electronics and textiles. However, the apprearance and usability of the clothing are maintained. A protolype for the encasing has been implemented, in which a temperature sensor is embedded inside the button The contact between the button and clothing IS implemented by sewing with electrrcally conductive fiber yarn Protowpe tests have shown that the encasing IS directly suitable to be used in a range of applications and galvanic connections are possible to implement by sewing with electrically conductive fibers.</p>
INDEX TERMS
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CITATION

J. Htinnikainen, J. Mikkonen and J. Vanhala, "Button Component Encasing for Wearable Technology Applications," Ninth IEEE International Symposium on Wearable Computers (ISWC'05)(ISWC), Osaka, Japan, 2005, pp. 204-205.
doi:10.1109/ISWC.2005.14
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