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Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment (2005)
New Orleans, LA, USA
May 16, 2005 to May 19, 2005
ISSN: 1095-2020
ISBN: 0-7803-8910-7
TABLE OF CONTENTS

Scope and format (PDF)

pp. iii

Green MST design from a designer's perspective: how to base decisions on environmental issues (PDF)

K. Schischke , Res. Center Microperipheric Technol., Tech. Univ. of Berlin, Germany
A. Middendorf , Res. Center Microperipheric Technol., Tech. Univ. of Berlin, Germany
H. Reichl , Res. Center Microperipheric Technol., Tech. Univ. of Berlin, Germany
pp. 13-18

Cycle evaluation of combined heat and power alternatives in data centers (PDF)

A. Shah , Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
pp. 19-24

Analyzing and modeling of uncertainty factors influencing product recyclability (PDF)

Qi Yunhui , Sch. of Mech. & Automotive Eng., Hefei Univ. of Technol., China
Liu Guangfu , Sch. of Mech. & Automotive Eng., Hefei Univ. of Technol., China
Liu Zhifeng , Sch. of Mech. & Automotive Eng., Hefei Univ. of Technol., China
Wang Shuwang , Sch. of Mech. & Automotive Eng., Hefei Univ. of Technol., China
pp. 25-30

Directly addressing uncertainty in ESH evaluation (PDF)

Yue Chen , Dept. of Chem. Eng., MIT, Cambridge, MA, USA
G.J. McRae , Dept. of Chem. Eng., MIT, Cambridge, MA, USA
K.K. Gleason , Dept. of Chem. Eng., MIT, Cambridge, MA, USA
pp. 31-35

A non-profit/municipality/corporate partnership: innovative model for collecting end-of-life electronics (PDF)

A. Whitley , Dell Inc., Round Rock, TX, USA
M. Watson , Dell Inc., Round Rock, TX, USA
B. Hilton , Dell Inc., Round Rock, TX, USA
pp. 36-39

Sony's Green Partner program (PDF)

K. Hirai , Corporate Environ., Safety & Health, Sony Electron. Inc., San Diego, CA, USA
J. Mabee , Corporate Environ., Safety & Health, Sony Electron. Inc., San Diego, CA, USA
D. Smith , Corporate Environ., Safety & Health, Sony Electron. Inc., San Diego, CA, USA
M. Small , Corporate Environ., Safety & Health, Sony Electron. Inc., San Diego, CA, USA
pp. 54-59

Networked RFID systems in product recovery management (PDF)

A.G. Kulkarni , Inst. for Manuf., Cambridge Univ., UK
A.K.N. Parlikad , Inst. for Manuf., Cambridge Univ., UK
D.C. McFarlane , Inst. for Manuf., Cambridge Univ., UK
M. Harrison , Inst. for Manuf., Cambridge Univ., UK
pp. 66-71

Mixing entropy and product recycling (PDF)

T.G. Gutowski , Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
J.B. Dahmus , Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
pp. 72-76

Life-cycle impacts of lead and lead-free solder used in wave soldering of electronics (PDF)

M.L. Socolof , Environ., Trade & Agric., Abt Associates Inc., Bethesda, MD, USA
pp. 96-101

Disassembling approaches and quality assurance of electronic components mounted on PCBs (PDF)

Wa Layiding , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Xiang Dong , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Mou Peng , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
pp. 116-120

Design for active disassembly (DfAD): an outline for future research (PDF)

B. Willems , Dept. of Mech. Eng., Katholieke Universiteit Leuven, Belgium
W. Dewulf , Dept. of Mech. Eng., Katholieke Universiteit Leuven, Belgium
J. Duflou , Dept. of Mech. Eng., Katholieke Universiteit Leuven, Belgium
pp. 129-134

PC power consumption - a challenge and opportunity (PDF)

T. Brady , Intel Corp., Santa Clara, CA, USA
D. Bodas , Intel Corp., Santa Clara, CA, USA
D. Gabel , Intel Corp., Santa Clara, CA, USA
B. Griffith , Intel Corp., Santa Clara, CA, USA
T. Niemela , Intel Corp., Santa Clara, CA, USA
D. Perchlik , Intel Corp., Santa Clara, CA, USA
pp. 140-145

New microprocessor features for lower power and increased performance: doing "Moore's" with less (PDF)

D. Sadowy , Worldwide Environ., Health & Safety, AMD, Sunnyvale, CA, USA
pp. 146-150

80 plus: a strategy for reducing the inherent environmental impacts of computers (PDF)

C. Calwell , Policy & Res. Director, Ecos Consulting, Durango, CO, USA
P. Ostendorp , Policy & Res. Director, Ecos Consulting, Durango, CO, USA
pp. 151-156

Electronic data exchange standards and technology developments to support eco-compliance (PDF)

R. Kubin , iNEMI Mater. Composition Data Exchange Project, E2open Inc., Redwood, CA, USA
pp. 163-166

The IPC material declaration handbook (PDF)

J. Sharp , Connection Syst. Div., Teradyne Inc., Nashua, NH, USA
pp. 167-172

Simulation of household factor X in Japan (PDF)

T. Aoe , Corporate Environ. Affairs Div., Matsushita Electr. Ind. Co., Ltd, Kadoma, Japan
pp. 173-176

Residential computer usage patterns in Japan and associated life cycle energy use (PDF)

E. Williams , Environ. & Sustainable Dev. Programme, United Nations Univ., Tokyo, Japan
pp. 177-182

Impacts of ubiquitous society on the global warming problem in 2010 (PDF)

M. Matsumoto , Fundamental & Environ. Res. Labs., NEC Corp., Tsukuba, Japan
J. Hamano , Fundamental & Environ. Res. Labs., NEC Corp., Tsukuba, Japan
T. Tamura , Fundamental & Environ. Res. Labs., NEC Corp., Tsukuba, Japan
H. Iguchi , Fundamental & Environ. Res. Labs., NEC Corp., Tsukuba, Japan
pp. 183-188

Case study: multi life cycle center for electronic products (PDF)

R. Knoth , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
B. Kopacek , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
P. Kopacek , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
pp. 194-198

New solutions for reusing nonmetals reclaimed from waste printed circuit boards (PDF)

Mou Peng , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Xiang Dong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Pan Xiaoyong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Wa Layiding , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Gao Jiangang , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
pp. 205-209

Disassembly analysis, material composition analysis and environmental impact analysis for computer drives (PDF)

S. Mohite , Ind. Eng., Texas Tech Univ., Lubbock, TX, USA
Hong-Chao Zhang , Ind. Eng., Texas Tech Univ., Lubbock, TX, USA
pp. 215-220

Environmental indicators for ICT products - a practical approach based on four steps (PDF)

N. Warburg , Dept. Life Cycle Eng., Stuttgart IKP Univ., Leinfelden-Echterdingen, Germany
A. Braune , Dept. Life Cycle Eng., Stuttgart IKP Univ., Leinfelden-Echterdingen, Germany
P. Eyerer , Dept. Life Cycle Eng., Stuttgart IKP Univ., Leinfelden-Echterdingen, Germany
pp. 226-230

Existing and future avenues for eco-efficient e-scrap recycling (PDF)

J. Huisman , Design for Sustainability Res. Group, Delft Univ. of Technol., Netherlands
pp. 231-236

E-waste and the consumer: improving options to reduce, reuse and recycle (PDF)

C.N. Cairns , Tech. Div., Consumers Union, Yonkers, NY, USA
pp. 237-242

Effective assessment of Japanese recycling law for electrical home appliances: four years after the full enforcement of the law (PDF)

T. Tasaki , Res. Center for Material Cycles & Waste Manage., National Inst. for Environ. Studies, Tsukuba, Japan
A. Terazono , Res. Center for Material Cycles & Waste Manage., National Inst. for Environ. Studies, Tsukuba, Japan
Y. Moriguchi , Res. Center for Material Cycles & Waste Manage., National Inst. for Environ. Studies, Tsukuba, Japan
pp. 243-248

Analysis of an adaptive fuzzy system for disassembly process planning (PDF)

M. Turowski , Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
Ying Tang , Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
M. Morgan , Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
pp. 249-254

Intelligent disassembly sequence planning for EOL recycling based on hierarchical fuzzy cognitive map (PDF)

Pan Xiaoyong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Xiang Dong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Mou Peng , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
pp. 255-259
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