The Community for Technology Leaders
Electronics and the Environment, International Symposium on (2004)
Scottsdale, AZ, USA
May 10, 2004 to May 13, 2004
ISBN: 0-7803-8250-1
TABLE OF CONTENTS
Papers

Economic sustainability of reuse as an end-of-life management tool for computers and televisions (Abstract)

L. Rubinstein , Northeast Recycling Council Inc. (NERC), Brattleboro, USA
pp. 1-6

Making sustainability accountable: a valuation model for corporate performance (Abstract)

Ling Wang , Dept. of Ind. Eng., State Univ. of New York, Buffalo, NY, USA
Li Lin , Dept. of Ind. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 7-12

Environmental impact of information and communication technologies including rebound effects (Abstract)

H. Tatemichi , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
S. Nishi , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
K.I. Takahashi , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
T. Tanaka , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
pp. 13-16

A macroeconomic analysis of the relationship between IT industries and environmental policies (Abstract)

T. Tamura , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
M. Tekawa , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
J. Fujimoto , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
M. Matsumoto , Fundamental Res. Labs., NEC Corp., Tsukuba, Japan
pp. 17-22

Life cycle tools for future product sustainability (Abstract)

L.A. Przekop , Fundamental Res. Labs., NEC Corp., Tsukuba, Japan
S. Kerr , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
pp. 23-26

Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages (Abstract)

D. Huff , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
K. Stinson-Bagby , Opt. Devices Group, Luna Innovations Inc., Blacksburg, VA, USA
D. Katsis , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
D. Van Wyk , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
pp. 27-32

Environmental assessment of halogen-free printed circuit boards, a design for environment (DfE) project with the high density packaging user group (HDPUG) (Abstract)

A. Whitley , Dell, Austin, TX, USA
S. Ching , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
S. O'Connell , Dell, Austin, TX, USA
T. Brady , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
pp. 40-45

End-of-life and regulatory issues for flame retardant plastics used in electrical and electronic equipment applications (Abstract)

S.D. Landry , Albemarle Corp., Baton Rouge, LA, USA
R.B. Dawson , Albemarle Corp., Baton Rouge, LA, USA
pp. 46-50

A decision-support tool for the take-back of plastics from end-of-life electronics (Abstract)

A. Horvath , Albemarle Corp., Baton Rouge, LA, USA
E.R. Masanet , Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
pp. 51-56

An economic model for end-of-life management of printed circuit boards (Abstract)

H.C. Zhang , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
N.U. Rao , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
C.Y. Yuan , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 57-62

Developing product recovery services: a case study from the electrical power network construction industry (Abstract)

M. Herold , Dept. of Ind. Eng. & Manage., Helsinki Univ. of Technol., Finland
pp. 63-67

Methodology for recycling potential evaluation criterion of waste home appliances considering environmental and economic factor (Abstract)

Kwangho Park , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
Yongwoo Hwang , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
Junbeum Kim , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.S. Matthews , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 68-73

Environmental and economic trade-offs in consumer electronic products recycling: a case study of cell phones and computers (Abstract)

O.A. Ogunseitan , Dept. of Environ. Health, Sci., & Policy, California Univ., Irvine, CA, USA
A.A. Shapiro , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
A.K. Bhuie , Dept. of Environ. Health, Sci., & Policy, California Univ., Irvine, CA, USA
J.-D.M. Saphores , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 74-79

Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impacts (Abstract)

S. Boyd , Mech. Eng., California Univ., Berkeley, CA, USA
N. Krishnan , Mech. Eng., California Univ., Berkeley, CA, USA
D. Dornfeld , Mech. Eng., California Univ., Berkeley, CA, USA
J. Rosales , Mech. Eng., California Univ., Berkeley, CA, USA
pp. 86-89

Development of a hybrid environmental impact assessment model: a case study on computer displays (Abstract)

Xiaoying Zhou , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
J.M. Schoenung , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
pp. 91-96

Comparative analysis of the manufacturing and consumer use phases of two generations of semiconductors [microprocessors] (Abstract)

A.R. Wilson , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
T.J. McManus , Mech. Eng., California Univ., Berkeley, CA, USA
F. Shadman , Mech. Eng., California Univ., Berkeley, CA, USA
M.A. Yao , Intel Corp., Santa Clara, CA, USA
pp. 97-103

Recycling and extended life of electric home appliances: hybrid analysis based on the waste input-output model (Abstract)

S. Nakmura , Sch. of Politics & Econ., Waseda Univ., Tokyo, Japan
Y. Kondo , Sch. of Politics & Econ., Waseda Univ., Tokyo, Japan
pp. 104-105

Comparative analysis of traditional telephone and voice-over-Internet protocol (VoIP) systems (Abstract)

Y. Kondo , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
H.S. Matthews , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 106-111

Energy resource management in the virtual data center (Abstract)

T. Abels , Dell Inc., Austin, TX, USA
R. White , Dell Inc., Austin, TX, USA
pp. 112-116

Life-cycle assessment of an intelligent lighting system using a distributed wireless mote network (Abstract)

A.M. Agogino , Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
A. Horvath , Mech. Eng., California Univ., Berkeley, CA, USA
M. Dubberley , Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
pp. 122-127

Power management of computers (Abstract)

D. Korn , Cadmus Group, Inc., Watertown, MA, USA
R. Huang , Cadmus Group, Inc., Watertown, MA, USA
D. Beavers , Cadmus Group, Inc., Watertown, MA, USA
T. Bolioli , Mech. Eng., California Univ., Berkeley, CA, USA
pp. 128-131

Sustainability and end-of-life product management: a case study of electronics collection scenarios (Abstract)

R.J. Caudill , Multi-lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
D.A. Dickinson , Multi-lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 132-137

An overview of environmental product performance measurement in the Asian electronics industry (Abstract)

O. Pascual , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
C. Boks , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
pp. 138-143

Operational sustainability metrics - assessing performance of electronics recycling systems (Abstract)

R. Kirchain , Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
J. Atlee , Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
pp. 144-149

A review of environmental accounting practices in the Asian electronics industry (Abstract)

C. Boks , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
O. Pascual , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
pp. 150-155

Environmental implications of PCB manufacturing in China (Abstract)

Jinqiu Xu , Shanghai Second Poly-technic Univ., China
Jingwei Wang , Shanghai Second Poly-technic Univ., China
pp. 156-158

The environmental impacts of electronics. Going beyond the walls of semiconductor fabs (Abstract)

A. Plepys , Int. Inst. for Ind. Environ. Econ., Lund Univ., Sweden
pp. 159-165

Smart disassembly [joint separation method] (Abstract)

T. Suga , Cadmus Group, Inc., Watertown, MA, USA
K. Halada , Ecomaterials Center, Nat. Inst. for Mater. Sci., Ibaraki, Japan
N. Hosoda , Ecomaterials Center, Nat. Inst. for Mater. Sci., Ibaraki, Japan
pp. 166-167

Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation [electronics] (Abstract)

K. Schischke , Berlin Center of Adv. Packaging, Germany
H. Poetter , Berlin Center of Adv. Packaging, Germany
H. Reichl , Berlin Center of Adv. Packaging, Germany
O. Ness , Berlin Center of Adv. Packaging, Germany
H. Griese , Berlin Center of Adv. Packaging, Germany
pp. 173-178

Service to extend the life of TV sets (Abstract)

A. Stevels , Design for Sustainability Lab., Delft Univ. of Technol., Netherlands
M. Boekee , Design for Sustainability Lab., Delft Univ. of Technol., Netherlands
pp. 179-182

Mathematical model of reusability (Abstract)

S. Yamamoto , Dept. of Mech. Syst. Eng., Hiroshima Univ., Japan
T. Murayama , Dept. of Mech. Syst. Eng., Hiroshima Univ., Japan
F. Oba , Dept. of Mech. Syst. Eng., Hiroshima Univ., Japan
pp. 183-188

Baseline study of noncommercial computer reuse in the United States (Abstract)

J. Lynch , CompuMentor, San Francisco, CA, USA
pp. 189-194

A decade of processing end of life IT equipment - lessons learned at the IBM/sub /spl trade// Endicott asset recovery center (Abstract)

E.J. Grenchus , IBM Corp., Endicott, NY, USA
R.A. Keene , IBM Corp., Endicott, NY, USA
C.R. Nobs , IBM Corp., Endicott, NY, USA
pp. 195-198

Complying with extended producer responsibility requirements: business impacts, tools and strategies [electronic products] (Abstract)

V. Bell , Environ. Packaging Int., Jamestown, RI, USA
J. McCracken , Environ. Packaging Int., Jamestown, RI, USA
pp. 199-203

The role of success factors and obstacles in design for environment: a survey among Asian electronics companies (Abstract)

O. Pascual , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
C. Boks , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
pp. 208-213

A distributed design methodology for extensible product life cycle strategy [electronic products] (Abstract)

H.C. Zhang , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
Jianzhi Li , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
P. Shrivastava , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 214-219

Using dynamic reliability models to extend the economic life of strongly innovative products (Abstract)

A.C. Brombacher , Berlin Center of Adv. Packaging, Germany
J.A. van den Bogaard , Flextronics, Venray, Netherlands
D. Shangguan , Flextronics, Venray, Netherlands
J.S.R. Jayaram , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
G. Hulsken , Berlin Center of Adv. Packaging, Germany
pp. 220-225

Used consumer electronics: a comparative analysis of materials recycling technologies (Abstract)

J.M. Schoenung , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
Hai-Yong Kang , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
pp. 226-230

Investigations on the metallurgical use of CRT and LCD glass [smelting flux applications] (Abstract)

C. Samuelsson , Dept. of Process Metall., Tech. Univ., Lulea, Sweden
T. Lehner , Dept. of Chem. Eng. & Mater. Sci., California Univ., Davis, CA, USA
pp. 231-236

A physical process for recycling and reusing waste printed circuit boards (Abstract)

Gao Jiangang , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Mou Peng , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Xiang Dong , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Wa Layiding , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
pp. 237-242

Eco-efficient implementation of electronic waste policies in practice (Abstract)

J. Huisman , Design for Sustainability Res. Program, Delft Univ. of Technol., Netherlands
A. Stevels , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
pp. 243-248

A business-mapping approach to multi-criteria group selection of collection centers and recovery facilities (Abstract)

K.K. Pochampally , Dept. of MIME, Northeastern Univ., Boston, MA, USA
S.M. Gupta , Dept. of MIME, Northeastern Univ., Boston, MA, USA
pp. 249-254

Environmentally effective policy directions for computers (Abstract)

R. Kuehr , Zero Emissions Forum, United Nations Univ., Hamburg, Germany
pp. 255-257

The silence of silicon lambs: speaking out health and environmental impacts within Taiwan's Hsinchu Science-based industrial park (Abstract)

Hua-mei Chiu , Dept. of MIME, Northeastern Univ., Boston, MA, USA
Shenglin Chang , Dept. of Natural Resource Sci. & Landscape Archit., Maryland Univ., MD, USA
Wenling Tu , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
pp. 258-263

Evaluating supply line sustainability and business environmental risk (Abstract)

D.A. Dickinson , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
Soontae Jeong , United Technol. Corp., Hartford, CT, USA
R.J. Caudill , Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing, China
H.J. Cline , United Technol. Corp., Hartford, CT, USA
T.E. Swarr , United Technol. Corp., Hartford, CT, USA
pp. 264-269

Customer perception of buying new but unpacked electronics products (Abstract)

R. Wever , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
C. Boks , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
S. Galjaard , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
M. Huisman , Sch. of Ind. Design Eng., Delft Univ. of Technol., Netherlands
pp. 270-274

Bridging the information gap: material tracking and consumer labels to encourage sustainable computing (Abstract)

M. Rau , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
N. Kowalski , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
N. McCullar , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Goh , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Blackmore , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
G. King , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 275-280

Development of XML industry standards for information exchange and commerce [electronics recycling industry example] (Abstract)

W. Alcorn , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Tucker , D.N. American Inc., Fairmont, WV, USA
K. Kaplan , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 281-286

Sustainable electrical and electronic plastics recycling (Abstract)

M. Fisher , American Plastics Council, Arlington, VA, USA
T. Kingsbury , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
L. Headley , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 292-297

Absence of free, unbound carbon black in printer toners: a California Proposition 65 study (Abstract)

E. Balstad , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Brooks , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Barakat , Dept. of Civil & Environ. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Fong , Corporate Environ. Affairs, IBM Corp., San Jose, CA, USA
pp. 298-303

Case study: multi life cycle center [waste electric and electronic equipment recycling] (Abstract)

B. Kopacek , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
R. Knoth , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
M. Brandstotter , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
P. Kopacek , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
pp. 304-308

GPS and radio tracking of end-of-life products [recycling and waste disposal applications] (Abstract)

J.A. Lee , Dept. of Electr. Eng., Princeton Univ., NJ, USA
V.M. Thomas , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 309-312

Linking bar codes to recycling information for mobile phones (Abstract)

V.M. Thomas , Dept. of Electr. Eng., Princeton Univ., NJ, USA
M. Stutz , Motorola Adv. Technol. Center - Eur., Motorola, Taunusstein, Germany
S. Saar , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
pp. 313-316

Data security issues relating to end of life equipment (Abstract)

P.F. Bennison , Waste Manage. & Recycling Products, Inc., Schenectady, NY, USA
P.J. Lasher , Waste Manage. & Recycling Products, Inc., Schenectady, NY, USA
pp. 317-320

Efficient design and effective marketing of a reverse supply chain: a fuzzy logic approach (Abstract)

S.M. Gupta , Dept. of MIME, Northeastern Univ., Boston, MA, USA
K.K. Pochampally , Dept. of MIME, Northeastern Univ., Boston, MA, USA
pp. 321-326

Author index (PDF)

pp. 327-328
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