The Community for Technology Leaders
Electronics and the Environment, International Symposium on (2003)
Boston, MA, USA
May 19, 2003 to May 22, 2003
ISBN: 0-7803-7743-5
TABLE OF CONTENTS
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Is the WEEE Directive EcoEfficient? (Abstract)

A. Stevels , Design for Sustainability Lab., Delft Univ. of Technol., Netherlands
pp. 7-12

X-free mobile electronics-strategy for sustainable development (Abstract)

J. Mueller , Dept. Environ. Eng., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
H. Griese , Dept. Environ. Eng., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
M. Hageluken , Dept. Environ. Eng., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
pp. 13-18

Alternatives to reduce perfluorinated compound (PFC) emissions from semiconductor dielectric etch processes: meeting environmental commitments while minimizing costs (Abstract)

R. Smati , Dept. Environ. Eng., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
N. Krishnan , Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
S. Raoux , Dept. Environ. Eng., Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
pp. 19-24

Strategies to integrate life cycle engineering into technological developments-the 3G Greenbook Initiative (Abstract)

H. Griese , Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
J. Muller , Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
L. Stobbe , Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
pp. 25-29

Construction of dynamic green supply chain based on agent (Abstract)

Liu zhifeng , Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
Wang shuwang , Sch. of Mech. & Automobile Eng., Hefei Univ. of Technol., China
Zheng ren , Fraunhofer Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
pp. 30-35

Lean disassembly line layout, and network simulation models (Abstract)

L.C. Morales , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
P.G. Ranky , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
R.J. Caudill , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 36-41

Practical aspects of the materials declaration process (Abstract)

E.R. Masanet , Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
R. Auer , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
M.D. Newton , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 42-47

Multi-criteria decision aid for product end of life options selection (Abstract)

D. Kiritsis , LICP-IPR-STI, Ecole Polytech. Fed. de Lausanne, Switzerland
P. Xirouchakis , LICP-IPR-STI, Ecole Polytech. Fed. de Lausanne, Switzerland
A. Bufardi , LICP-IPR-STI, Ecole Polytech. Fed. de Lausanne, Switzerland
pp. 48-53

Disassembly AND/OR graph model for "disassembly for recycling" (Abstract)

Jiangang Gao , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Haifeng Chen , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Jinsong Wang , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Guanghong Duan , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Dong Xiang , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
pp. 54-59

DISX: a procedure for the automated generation of disassembly process plans (Abstract)

S. Gurram , Multi Life-Cycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
D. Yedlarajiah , Multi Life-Cycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
S. Das , Multi Life-Cycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 60-65

Cradle to gate toxic impacts of solders: a comparison of impact assessment methods (Abstract)

M.B. Swanson , Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
M.L. Socolof , Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
J.R. Geibig , Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
pp. 66-71

A multi-phase mathematical programming approach to strategic planning of an efficient reverse supply chain network (Abstract)

K.K. Pochampally , Dept. of MIME, Northeastern Univ., Boston, MA, USA
S.M. Gupta , Dept. of MIME, Northeastern Univ., Boston, MA, USA
pp. 72-78

Supply chain management and reverse logistics-integration of reverse logistics processes into supply chain management approaches (Abstract)

A. Fritsch , Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
C. Butz , Dept. of MIME, Northeastern Univ., Boston, MA, USA
H. Baumgarten , Dept. of MIME, Northeastern Univ., Boston, MA, USA
T. Sommer-Dittrich , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
pp. 79-83

Reconfigurable logistics systems for efficient processes-a new planning tool set (Abstract)

C. Butz , Dept. of MIME, Northeastern Univ., Boston, MA, USA
H. Baumgarten , Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
T. Sommer-Dittrich , Dept. of MIME, Northeastern Univ., Boston, MA, USA
pp. 84-87

Green product development in quality function deployment by using fuzzy logic analysis (Abstract)

Tsai-Chi Kuo , Dept. of Ind. Eng. & Manage., Minglisin Univ. of Sci. & of Technol., Hsinchu, Taiwan
pp. 88-93

Special requirements for demanufacturing of military electronics (Abstract)

P.G. Churchill , Concurrent Technol. Corp., Nat. Defense Center for Environ. Excellence, Largo, FL, USA
pp. 94-98

Economic and environmental characteristics of global cellular telephone remanufacturing (Abstract)

Fu Zhao , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
Kuei-yuan Chan , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
W.R. Morrow , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
S.J. Skerlos , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
A. Hula , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
pp. 99-104

Plastic separation planning enhancements from new laser identification technology and work measurement analysis (Abstract)

N. Meyer , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
J.A. Stuart , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
L. Blyler , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
L. Tieman , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
L. Duplaga , Dept. of Mech. Eng., Michigan Univ., Ann Arbor, MI, USA
pp. 105-110

Implementing DFE through a product-based environmental management system (Abstract)

K. Donnelly , Lucent Technol. Bell Labs., Whippany, NJ, USA
T. Boehm , Lucent Technol. Bell Labs., Whippany, NJ, USA
pp. 111-113

Design for environment: an environmental analysis model for the modular design of products (Abstract)

Xueqing Qian , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
H.C. Zhang , Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
pp. 114-119

Life cycle assessment tool for electromechanical products green design (Abstract)

Xiang Dong , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Wang Jinsong , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Wu Ying , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Liu Xueping , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
pp. 120-124

Material composition profiles of select IT components, a design for environment project with the High Density Packaging User Group (HDPUG) (Abstract)

P. Senfield , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
R. Bergman , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
T.A. Brady , Product Ecology, Intel Corp., Chandler, AZ, USA
P. Tanskanen , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
S. O'Connell , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
pp. 125-130

Electricity use of wired and wireless telecommunications networks in the United States (Abstract)

H.S. Matthews , Carnegie Mellon Univ., Pittsburgh, PA, USA
H.S. Matthews , Carnegie Mellon Univ., Pittsburgh, PA, USA
H.S. Matthews , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 131-136

Environmental effects of information telecommunication networks in Japan (Abstract)

T. Kunioka , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
T. Origuchi , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
J. Nakamura , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
K.I. Takahashi , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
T. Maeda , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 137-140

Life cycle assessment of the mobile communication system UMTS: towards eco-efficient systems (Abstract)

M.F. Emmenegger , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
M. Guggisberg , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
M. Stutz , NTT Energy & Environ. Syst. Labs., NTT Corp., Kanagawa, Japan
R. Witschi , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
R. Frischknecht , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 141-146

Sustainable product and material end-of-life management: an approach for evaluating alternatives (Abstract)

R.J. Caudill , Multi-Lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
D.A. Dickinson , Multi-Lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 153-158

Neural network model for product end-of-life strategies (Abstract)

J.L. Chen , Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jun-Nan Wu , Multi-Lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
pp. 159-164

Checklist for optimized design for re-use of printed wire boards and components (Abstract)

P. Kopacek , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
R. Knoth , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
M. Brandstotter , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
B. Kopacek , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 165-168

A tool to support environmentally preferable purchasing of electronic products (Abstract)

L. Chalfan , Carnegie Mellon Univ., Pittsburgh, PA, USA
D. Stitzhal , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
W. Rifer , Zero Waste Alliance, Portland, OR, USA
pp. 169-172

Life cycle environmental impact of the Internet infrastructure in a university (Abstract)

Sangwon Suh , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
O. Jolliet , Carnegie Mellon Univ., Pittsburgh, PA, USA
Y. Loerincik , Group for Ind. Ecology & Life Cycle Syst., Swiss Inst. of Technol., Lausanne, Switzerland
pp. 173-176

"The most of the most"-study on a new LCA method (Abstract)

Liu Zhifeng , Austrian Soc. for Syst. Eng. & Autom., Vienna, Austria
Liu Lei , Sch. of Mech. & Automotive Eng., Hefei Univ. of Technol., China
R. Fung , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 177-182

Life cycle environmental impact of the telemonitoring system of the city of Martigny Switzerland (Abstract)

C. Matas , Carnegie Mellon Univ., Pittsburgh, PA, USA
O. Jolliet , Group for Ind. Ecology & Life Cycle Syst., Swiss Inst. of Technol., Lausanne, Switzerland
J.M. Revaz , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Y. Loerincik , Group for Ind. Ecology & Life Cycle Syst., Swiss Inst. of Technol., Lausanne, Switzerland
pp. 183-186

Energy analysis of end-of-life options for personal computers: resell, upgrade, recycle (Abstract)

Y. Sasaki , Group for Ind. Ecology & Life Cycle Syst., Swiss Inst. of Technol., Lausanne, Switzerland
E.D. Williams , United Nations Univ., Tokyo, Japan
pp. 187-192

Validating an environmental performance improvement model for large and small companies (Abstract)

D.M. Hussey , Gaylord Nelson Inst. of Environ. Studies, Wisconsin Univ., Madison, WI, USA
P.D. Eagan , Group for Ind. Ecology & Life Cycle Syst., Swiss Inst. of Technol., Lausanne, Switzerland
pp. 193-198

Integration of environmental assessment tools in product development (Abstract)

H. Griese , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
A. Middendorf , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
C. Petermann , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
J. Schrodl , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
H. Reichl , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
pp. 199-204

A technique used for estimating the processing cost of IT equipment received by an asset recovery center (Abstract)

R.A. Keene , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
E.J. Grenchus , Global Asset Recovery Services, IBM Corp., Endicott, NY, USA
pp. 205-208

Repair or buy a new one? The environmental consequences for electronics (Abstract)

J.B. Legarth , Global Asset Recovery Services, IBM Corp., Endicott, NY, USA
O. Willum , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
I. Salter , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
pp. 209-213

Assessing integrated circuit manufacturing for environmental performance and sustainability: a full scale IC business application (Abstract)

D.A. Dickinson , Multi-Lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
S.D. Houthuysen , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
J.A. Mosovsky , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
pp. 214-219

Becoming a zero waste to landfill facility (Abstract)

L. Gjetley , Ricoh Electron. Inc., Tustin, CA, USA
F. Pierre , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
pp. 220-223

Product sustainability improvement based on performance of product components (Abstract)

Mengchu Zhou , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
G. Meimei , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 224-229

Two innovative technologies used in the latest sustainable multifunctional office equipment (Abstract)

I. Kakegawa , Environ. Manage. Div, Ricoh Corp., Pine Brook, NJ, USA
pp. 230-233

Dynamic scheduling and line balancing methods, and software tools for lean and reconfigurable disassembly cells and lines (Abstract)

R.J. Caudill , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
N. Alli , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
K. Limaye , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
M. Subramanyam , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
P.G. Ranky , Dept. of Ind. & Manuf. Syst. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 234-239

Creating business value and environmental performance through the use of customer-focused quality tools (Abstract)

P. Eagan , Coll. of Eng., Wisconsin Univ., WI, USA
M.P. Finster , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
D. Hussey , Res. Center for Microperipherik, Technische Univ. Berlin, Germany
pp. 240-245

Web based ecodesign supporting system for electronic products (Abstract)

Youngdeog Koh , Ecofrontier Co., KAIST, Seoul, South Korea
Tak Hur , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
Jungman Chung , Ecofrontier Co., KAIST, Seoul, South Korea
Hankyung Lee , Ecofrontier Co., KAIST, Seoul, South Korea
pp. 246-250

Extending PC lifespan through secondary markets (Abstract)

E.D. Williams , United Nations Univ., Tokyo, Japan
pp. 255-259

Ten facts to know about plastics from consumer electronics (Abstract)

M. Fisher , American Plastics Council, Arlington, VA, USA
L. Headley , Dept. of Precision Instruments & Mechanology, Tsinghua Univ., Beijing, China
J. Biancaniello , American Plastics Council, Arlington, VA, USA
T. Kingsbury , Ecofrontier Co., KAIST, Seoul, South Korea
pp. 260-264

Eco-efficiency of take-back and recycling, a comprehensive approach (Abstract)

A. Stevels , American Plastics Council, Arlington, VA, USA
J. Huisman , Design for Sustainability Res. Program, Delft Univ. of Technol., Netherlands
pp. 265-270

Emissions from the incineration of electronics industry waste (Abstract)

P.M. Lemieux , American Plastics Council, Arlington, VA, USA
E.S. Stewart , Office of Res. & Dev., U.S. EPA, Research Triangle Park, NC, USA
pp. 271-275

Life cycle inventory development for wafer fabrication in semiconductor manufacturing (Abstract)

C.F. Murphy , Texas Univ., Austin, TX, USA
D.T. Allen , Texas Univ., Austin, TX, USA
J.-P. Laurent , Texas Univ., Austin, TX, USA
pp. 276-281

Research about the quantified assess system on the life cycle of typical electromechanic product based on the economic character (Abstract)

Liu Gang , Dept. of Precision Instruments & Mech., Tsinghua Univ., Beijing, China
Wang Jingsong , Dept. of Precision Instruments & Mech., Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instruments & Mech., Tsinghua Univ., Beijing, China
Xian Dong , Dept. of Precision Instruments & Mech., Tsinghua Univ., Beijing, China
pp. 282-285

An information system management of assessment of disassembly and recycle (Abstract)

Wu Ying , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Xiang Dong , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Duan Guanghong , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Meng Peng , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Liu Xueping , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
pp. 286-290

Printed scholarly books and e-book reading devices: a comparative life cycle assessment of two book options (Abstract)

G.A. Keolelan , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
G.L. Kozak , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
pp. 291-296

An organizational change strategy to improve environmental protection (Abstract)

R. Cors , Eng. Professional Developt, Univ. of Wisconsin, Madison, WI, USA
P. Eagan , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
S.L. Courter , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
pp. 297-302

Communicating eco-efficiency in industrial contexts: a framework for understanding the (lack) of success and applicability of eco-design (Abstract)

O. Pascual , Design for Sustainability Program, Delft Univ. of Technol., Netherlands
A. Stevels , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
C. Boks , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
pp. 303-308

Assessing base level of service for electronics collection and recycling programs: Seattle-Tacoma case study (Abstract)

F. Marella , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
W. Rifer , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
R. Caudill , New Jersey Inst. of Technol., Newark, NJ, USA
S. Cole , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
S. Jackson , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
pp. 309-314

Integration of a product stewardship program: a case study (Abstract)

D.A. Lockwood , Corporate Environ. Director, Seagate Technol., Scotts Valley, CA, USA
C. Hazen , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
pp. 315-317

E&HS aspects on metal recovery from electronic scrap (Abstract)

T. Lehner , Corporate Environ. Director, Seagate Technol., Scotts Valley, CA, USA
pp. 318-322

Occupational risks associated with electronics demanufacturing and CRT glass processing operations and the impact of mitigation activities on employee safety and health (Abstract)

J. Katers , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
J. Barry , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
N. Peters-Michaud , Cascade Asset Manage., Madison, WI, USA
pp. 323-328

Is CRT glass-to-lead recycling safe and environmentally friendly? (Abstract)

D.H. Weitzman , RRT Design & Constr., Melville, NY, USA
pp. 329-334

Strategies to optimize return on investment (ROI) through effective reverse supply chain programs (Abstract)

M. Lund , Sch. of Natural Resources & Environ., Michigan Univ., Ann Arbor, MI, USA
J. Lee , RRT Design & Constr., Melville, NY, USA
pp. 335-340

A symbolic methodology to improve manual disassembly economics (Abstract)

L. Tieman , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
P. Rios , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
L. Duplaga , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
J.A. Stuart , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
L. Blyler , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 341-346

An environmentally conscious management model for end-of-life electromechanical products (Abstract)

H.C. Zhang , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
Xueqing Qian , Dept. of Ind. Eng., Texas Tech Univ., Lubbock, TX, USA
pp. 347-351

Wisconsin end-of-life electronics study (Abstract)

C. Diggelman , Archit. Eng. & Building Constr., Milwaukee Sch. of Eng., WI, USA
S. Brachman , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 352-357

Environmental benchmarking of medium-sized TVs sold in North America, Europe and Asia (China) (Abstract)

C. Boks , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
T. Carlier , Design for Sustainability Lab., Delft Univ. of Technol., Netherlands
B. Bras , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
S. Duncan , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
A. Stevels , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 358-364

Case studies for calculation of factor X (Abstract)

T. Aoe , Corporate Environ. Affairs Div., Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
M. Fukuda , Dept. of Precision Instruments, Tsinghua Univ., Beijing, China
Y. Matsuoka , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
T. Michiyasu , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
N. Shikata , Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 365-370

Introduction and development of a factor X (eco-efficiency) tool (Abstract)

T. Aoe , Corporate Environ. Affairs Div., Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 371-376

Designing for designers-ecodesign tools to inform and inspire (Abstract)

V. Lofthouse , IERC, Cranfield Univ., UK
pp. 377-382

Author Index (PDF)

pp. 383-385
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