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Advance Packaging Materials, International Symposium (2002)
Stone Mountain, GA, USA
Mar. 3, 2002 to Mar. 6, 2002
ISBN: 0-7803-7434-7
TABLE OF CONTENTS
Papers

High density, aspect ratio through-wafer electrical interconnect vias for low cost, generic modular MEMS packaging (Abstract)

K. Boustedt , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 8-11

Electrolessly deposited films in microelectronics and ULSI (Abstract)

T.N. Khoperia , E. Andronikashvili Inst. of Phys., Acad. of Sci., Tbilisi, Georgia
pp. 12-19

Templated nanoporous spin-on glass for high density interconnect applications (Abstract)

A.M. Padovani , Sch. of Chem. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 20-24

Process issues on peripheral to area-array bond pad redistribution (Abstract)

S.P.C. Law , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
pp. 25-29

Application of the transient liquid phase bonding to microelectronics and MEMS packaging (Abstract)

Jin-Woo Park , Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
pp. 30-38

Microstructure evolution of SnPb and SnAg/Cu BGA solder joints during thermal aging (Abstract)

G.J.S. Chou , Tyco Electron. Corp., Harrisburg, PA, USA
pp. 39-46

Development of solder interconnects wetting model (Abstract)

G.J.S. Chou , Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 47-53

Electrodeposition of ternary near-eutectic SnAgCu solders with an alkaline bath (Abstract)

Bioh Kim , ECD Div., Semitool Inc., Kalispell, MT, USA
pp. 54-60

High rate electrodeposition of near-eutectic PbSn solders (Abstract)

Bioh Kim , ECD Div., Semitool Inc., Kalispell, MT, USA
pp. 61-66

Could shock tests adequately replace drop tests? (Abstract)

E. Suhir , Iolon Inc., San Jose, CA, USA
pp. 67-81

Evaluation of board level reliability of Pb-free PBGA solder joints (Abstract)

S.-W.R. Lee , Electron. Packaging Lab., Hong Kong Univ. of Sci. & Technol., Kowloon, China
pp. 82-89

Thermo-mechanical reliability of lead-free solder interconnects (Abstract)

A. Schubert , Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
pp. 90-96

Thermomechanical reliability of flip chip on organic board during power cycling tests (Abstract)

Jian Zhang , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 97-103

Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages (Abstract)

S. Wiese , Inst. fur Halbleiter- und Mikrosystemtechnik, Technische Univ. Dresden, Germany
pp. 104-111

Inspection and Process evaluation for Flip Chip Bumping and CSP by scanning 3D confocal microscopy (Abstract)

A. Schick , Electron. Assembly Syst., Siemens Dematic AG, Munich, Germany
pp. 116-119

Processability and performance enhancement of high K polymer-ceramic nano-composites (Abstract)

Lianhua Fan , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 120-126

Development of low temperature processing thermoplastic intrinsically conductive polymer (Abstract)

L.L.W. Chow , Dept of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 127-131

Effects of zinc on the reliability of conductive adhesives (Abstract)

H. Takezawa , Devices Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 139-143

Reliability of electrically conductive adhesives (Abstract)

S.A. Kudtarkar , Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA
pp. 144-150

Flip Chip molding - Recent progress in flip chip encapsulation (Abstract)

T. Braun , Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
pp. 151-159

Wire density effect on wire sweep analysis for IC packaging (Abstract)

Chien-Chang Pei , Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 160-165

Understanding of electrically conductive adhesives: formulation, curing and conductivity (Abstract)

Lianhua Fan , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 184-187

Bi-block copolymer surfactant study for high dielectric constant polymer-ceramic composite (Abstract)

Yang Rao , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 188-193

Study and modeling of the curing behavior of no-flow underfill (Abstract)

Zhuqing Zhang , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 194-200

Novel filled no-flow underfill materials and process (Abstract)

Zhuqing Zhang , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 201-209

A study on improvement of thermal conductivity of underfill materials for electronic packaging (Abstract)

Haiying Li , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 210-215

Evaluation, optimization, and reliability of no-flow underfill process (Abstract)

M. Colella , Adv. Assembly Process Technol. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 216-220

Thermo-mechanical properties of epoxy formulations with low glass transition temperatures (Abstract)

Shijian Luo , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 226-231

Processing of no-flow fluxing underfill for flip chip assembly (Abstract)

T.L. Lazarakis , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 232-237

Study of dielectric properties of polymer composite as integral capacitor (Abstract)

Kyoung-sik Moon , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 238-242

A novel ultra high dielectric constant epoxy silver composite for embedded capacitor application (Abstract)

Y. Rao , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 243-248

Liquid crystal polymers (LCP) for high performance SOP applications (Abstract)

K. Brownlee , Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 249-253

Adhesion improvement of thermoplastic isotropically conductive adhesive (Abstract)

S. Liong , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 260-270

No-flow underfill process optimization for high yield and reliability in flip chip assembly (Abstract)

Chunho Kim , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 271-277

Effects of variations in design and process parameters on assembly process yield of area array solder interconnect packages (Abstract)

Chunho Kim , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 278-284

Fundamental analyses of fixture tooling design for flexible substrate assembly (Abstract)

Ruijun Chen , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 285-290

Adhesion of underfills toward tin/lead and lead-free solders (Abstract)

Lianhua Fan , Sch. of Mater. Sci. & Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 291-296

Measurement of residual stress in single crystal silicon wafers (Abstract)

I.D. Vrinceanu , George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 297-301

Minimum consumption wafer coating (Abstract)

A. Curtis , Flip Chip Div., Kulicke & Soffa, Phoenix, AZ, USA
pp. 302-310

UV induced attachment of ultrathin polymer films on silicon wafers (Abstract)

Mingdi Yan , Dept. of Chem., Portland State Univ., OR, USA
pp. 311-316

High frequency characteristics of liquid crystal polymer for system in a package application (Abstract)

Gang Zou , Div. of Electron. Production, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 337-341

New developments at AT&S in the area of advanced materials for printed wiring boards (Abstract)

T.M. Krziwanek , Ind. Sci. & Technol. Dept., AT&S AG, Leoben, Austria
pp. 342-347

Experience gained manufacturing HDI PWBs (Abstract)

T. Rapala-Virtanen , Aspocomp Group, Salo, Finland
pp. 348-355

A study of advanced ALIVH(R) interconnection technology (Abstract)

S. Ochi , Devices Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 356-361

Monolithically integrated 3-D micro-inductors and micro-transformers for RF applications (Abstract)

J.Y. Park , Microsystem Group, LG Electron. Inst. of Technol., Seoul, South Korea
pp. 362-363

Ultra-low fire palladium-silver electrode powders for COG dielectric (Abstract)

G.M. Berube , Ferro Electron. Mater. Syst., South Plainfield, NJ, USA
pp. 364-369

High-K, Pb-free dielectric compatible with Ag or Cu electrodes (Abstract)

I. Burn , Ferro Electron. Mater. Syst., Ferro Corp., South Plainfield, NJ, USA
pp. 370-374

Characterization and testing on integral passives for wireless applications (Abstract)

B.C. Kim , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 375-379
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