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2017 IEEE International Symposium on Workload Characterization (IISWC) (2017)
Seattle, WA, USA
Oct. 1, 2017 to Oct. 3, 2017
ISBN: 978-1-5386-1234-7
pp: 66-75
Ramyad Hadidi , Georgia Institute of Technology
Bahar Asgari , Georgia Institute of Technology
Burhan Ahmad Mudassar , Georgia Institute of Technology
Saibal Mukhopadhyay , Georgia Institute of Technology
Sudhakar Yalamanchili , Georgia Institute of Technology
Hyesoon Kim , Georgia Institute of Technology
ABSTRACT
Three-dimensional (3D)-stacking technology, which enables the integration of DRAM and logic dies, offers high bandwidth and low energy consumption. This technology also empowers new memory designs for executing tasks not traditionally associated with memories. A practical 3D-stacked memory is Hybrid Memory Cube (HMC), which provides significant access bandwidth and low power consumption in a small area. Although several studies have taken advantage of the novel architecture of HMC, its characteristics in terms of latency and bandwidth or their correlation with temperature and power consumption have not been fully explored. This paper is the first, to the best of our knowledge, to characterize the thermal behavior of HMC in a real environment using the AC-510 accelerator and to identify temperature as a new limitation for this state-of-the-art design space. Moreover, besides bandwidth studies, we deconstruct factors that contribute to latency and reveal their sources for high- and low-load accesses. The results of this paper demonstrates essential behaviors and performance bottlenecks for future explorations of packet-switched and 3D-stacked memories.
INDEX TERMS
Random access memory, Bandwidth, Power demand, Memory management, Organizations, Protocols
CITATION

R. Hadidi, B. Asgari, B. A. Mudassar, S. Mukhopadhyay, S. Yalamanchili and H. Kim, "Demystifying the characteristics of 3D-stacked memories: A case study for Hybrid Memory Cube," 2017 IEEE International Symposium on Workload Characterization (IISWC), Seattle, WA, USA, 2017, pp. 66-75.
doi:10.1109/IISWC.2017.8167757
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