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2010 International Conference on Measuring Technology and Mechatronics Automation (2010)
Changsha, China
Mar. 13, 2010 to Mar. 14, 2010
ISBN: 978-0-7695-3962-1
pp: 882-885
In order to measure the dynamic cutting temperature in high speed machining, a new method to prepare multi-layer thin film thermocouple sensor on a ceramic tool was presented. the sensor was fabricated on the ceramic tool’s rake face with the technology of magnetron sputtering, lithography, and plasma enhanced chemical vapor deposition (PECVD) methods. The preparation process of the multi-player thin films was expatiated. The high speed cutting temperature and cutting force data acquisition and measuring system was designed. The type of data acquisition card is ADlink PCI-9118HG. Simple and friendly human-machine interface was programmed with the application of VC++ technology and Tchart controllor to achieve real-time data acquisition, display and analysis of high-speed cutting temperature and cutting force. It was concluded from the experiment that the data acquisition and measuring system is easy and flexible to use.
Thin-film thermocouple, Cutting temperature, Cutting force, Data Acquisition, Measuring system

X. Zheng, Q. Zeng, X. Li, Z. Yu and K. Wu, "Cutting Temperature and Force Data Acquisition and Measuring System Design in High Speed Machining," 2010 International Conference on Measuring Technology and Mechatronics Automation(ICMTMA), Changsha, China, 2010, pp. 882-885.
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