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High Performance Computing and Grid in Asia Pacific Region, International Conference on (1997)
Seoul, Korea
Apr. 28, 1997 to May 2, 1997
ISBN: 0-8186-7901-8
pp: 89
B.T. Yun , Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
D.H. Choi , Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
ABSTRACT
A 3D analysis code for mixed convection flow through the printed circuit board (PCB) channel on which heat-generating chip modules are mounted has been developed. For uniformly distributed modules, a small domain containing a single module is considered with periodic and symmetric boundary conditions. Calculations have been made for various Grashof numbers to examine the effects of natural convection for both adiabatic and conducting wall conditions. The program is designed to run on the KAICUBE/Hanbit-1 parallel computer, and its performance on different machines is compared in this paper.
INDEX TERMS
printed circuits; heat flow analysis; fluid flow analysis; PCB channel; KAICUBE/Hanbit-1 parallel computer; 3D analysis code; mixed convection flow; printed circuit board; heat-generating chip modules; uniformly distributed modules; periodic boundary conditions; symmetric boundary conditions; Grashof numbers; adiabatic conditions; conducting wall conditions; performance
CITATION
B.T. Yun, D.H. Choi, "Analysis of heat and fluid flow in a PCB channel using KAICUBE/Hanbit-1 parallel computer", High Performance Computing and Grid in Asia Pacific Region, International Conference on, vol. 00, no. , pp. 89, 1997, doi:10.1109/HPC.1997.592128
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