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Brighton, Great Britain
Sept. 18, 1995 to Sept. 22, 1995
ISBN: 0-8186-7156-4
pp: 360
K.O. Petrosjanc , Moscow Univ. of Electron. & Math., Russia
I.A. Kharitonov , Moscow Univ. of Electron. & Math., Russia
N.I. Rybov , Moscow Univ. of Electron. & Math., Russia
P.P. Maltcev , Moscow Univ. of Electron. & Math., Russia
ABSTRACT
A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each design level the 3D temperature simulators are described to analyze the steady state and transient thermal behavior and connect the design results with the device and/or IC layout and packaging constructions. Practical examples are discussed illustrating the possibilities of developed techniques and software tools
INDEX TERMS
hybrid integrated circuits; monolithic integrated circuits; multichip modules; integrated circuit layout; circuit layout CAD; circuit analysis computing; thermal analysis; temperature distribution; integrated circuit modelling; software system; semiconductor device thermal analysis; hybrid ICs thermal analysis; monolith thermal analysis; multi-chip modules; 3D temperature simulators; transient thermal behavior; steady state thermal behavior; packaging constructions
CITATION
K.O. Petrosjanc, I.A. Kharitonov, N.I. Rybov, P.P. Maltcev, "Software system for semiconductor devices, monolith and hybrid IC's thermal analysis", EURODAC, 1995, European Design Automation Conference with EURO-VHDL, European Design Automation Conference with EURO-VHDL 1995, pp. 360, doi:10.1109/EURDAC.1995.527430
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