2013 18th IEEE European Test Symposium (ETS) (2011)
May 23, 2011 to May 27, 2011
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/ETS.2011.39
This paper presents a low-cost pre- and post-bond self-testing and calibration methodology for the successive approximation register (SAR) analog-to-digital converter (ADC) array in a three-dimensional (3-D) CMOS imager. The basic idea is to test and calibrate the SAR ADC by measuring the major carrier transitions (MCTs) of the internal digital-to-analog converter (DAC) capacitor array. During the pre-bond stage, when access to the die is very limited, we propose a calibration-oriented testing technique that only determines whether the ADC array can achieve the desired performance after calibration. This substantially reduces the required design-for-test (DfT) circuitry complexity and test time. Then, during the post-bond stage, more thorough characterization on the ADC array is performed, we utilize digital resources from the image signal processor (ISP) die to analyze the measurement results, compute the calibration parameters, and perform the digital calibration. Simulation results are presented to validate the proposed techniques.
mixed-signal testing, 3-D IC testing, calibration-oriented testing, pre-, post-bond testing, SAR ADC
P. Kang, J. Huang, Y. Lee, X. Huang, D. Kwai and Y. Chou, "A Pre- and Post-bond Self-Testing and Calibration Methodology for SAR ADC Array in 3-D CMOS Imager," 2011 16th IEEE European Test Symposium (ETS), Trondheim, 2011, pp. 39-44.