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Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on (2003)
Cannes, France
Apr. 30, 2003 to Apr. 30, 2003
ISBN: 0-7803-7066-X
TABLE OF CONTENTS
Papers

The impact of MEMS and NEMS on biotechnology in the 21st century (Abstract)

M. Madou , California Univ., Irvine, CA, USA
pp. 1

Systematic design of microstructures by topology optimization (Abstract)

O. Sigmund , Tech. Univ. Denmark, Lyngby, Denmark
pp. 2

Non destructive evaluation in micro dimensions (Abstract)

N. Meyendorf , Dayton Univ., OH, USA
pp. 3

Mixed system and component level T-CAD for micro fabrication (Abstract)

U. Hansen , Inst. for Microtechnol., TU Braunschweig, Germany
pp. 4-9

Behavioral modeling and simulation of micromechanical resonator for communications applications (Abstract)

S. Cases , MEMSCAP, Crolles, France
P. Nachtergaele , MEMSCAP, Crolles, France
L. Basteres , MEMSCAP, Crolles, France
C. Mandelbaum , MEMSCAP, Crolles, France
D. Bensaude , MEMSCAP, Crolles, France
pp. 21-26

Electronic test solutions for FlowFET fluidic arrays (Abstract)

H.G. Kerkhoff , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
M. Acar , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
pp. 27-32

Development of a 3D-CAD add-in for tolerance analysis and synthesis in micro systems (/spl mu/-ToAST) (Abstract)

C. Germer , Inst. for Eng. Design, Tech. Univ. of Braunschweig, Germany
H.-J. Franke , MEMSCAP, Crolles, France
S. Buttgenbach , MEMSCAP, Crolles, France
U. Hansen , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
pp. 33-38

Understanding faulty behavior of a peristaltic micropump (Abstract)

B. Kaminska , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
M. Knight , Dept. of Electr. & Comput. Eng., Oregon Health & Sci. Univ., Beaverton, OR, USA
J. House , MEMSCAP, Crolles, France
pp. 39-44

Design process supporting simulations on wafer level packages (Abstract)

D. Manessis , MEMSCAP, Crolles, France
J.-P. Sommer , Dept. of Mech. Reliability & Micro Mater., Fraunhofer-Inst. for Reliability & Micro Integration, Berlin, Germany
O. Wittler , Testable Design & Test of Microsyst. Group, MESA Res. Inst., Enschede, Netherlands
B. Michel , MEMSCAP, Crolles, France
pp. 45-49

On-chip testing of MEMS using pseudo-random test sequences (Abstract)

E. Simeu , TIMA Lab., Grenoble, France
C. Domingues , TIMA Lab., Grenoble, France
S. Mir , TIMA Lab., Grenoble, France
L. Rufer , TIMA Lab., Grenoble, France
pp. 50-55

VHDL-AMS modelling, simulation and testing of electrostatic micromotors (Abstract)

J.Y. Fourniols , TIMA Lab., Grenoble, France
A. Endemano , Dept. of Electron. & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK
S. Muratet , MEMSCAP, Crolles, France
A. Marchese , TIMA Lab., Grenoble, France
H. Camon , TIMA Lab., Grenoble, France
pp. 56-63

A compact MCM implementation of an embedded system for automotive applications (Abstract)

S.A. Bota , TIMA Lab., Grenoble, France
J. Samitier , TIMA Lab., Grenoble, France
B. Niessen , TIMA Lab., Grenoble, France
E. Cabruja , MEMSCAP, Crolles, France
J.L. Merino , Dept. of Electron., Barcelona Univ., Spain
pp. 64-68

A mixed-mode interface circuit for gas sensor control and measure (Abstract)

J.L. Merino , Dept. d'Electron., Barcelona Univ., Spain
S.A. Bota , TIMA Lab., Grenoble, France
A. Dieguez , Dept. d'Electron., Barcelona Univ., Spain
R. Casanova , Dept. d'Electron., Barcelona Univ., Spain
J. Samitier , MEMSCAP, Crolles, France
pp. 69-74

A study of electronic interface for MEMS Variable Optical Attenuator (VOA) (Abstract)

C. Lu , MEMSCAP, Crolles, France
C.S. Thian , Dept. d'Electron., Barcelona Univ., Spain
X.M. Zhang , TIMA Lab., Grenoble, France
H. Cai , Inst. for Infocomm. Res., Singapore, Singapore
C.W. Chan , Dept. d'Electron., Barcelona Univ., Spain
pp. 75-78

Parameter identification and macromodeling of hysteresis phenomena (Abstract)

R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
H.-G. Brachtendorf , TIMA Lab., Grenoble, France
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
S. Rehfuss , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 79-83

Construction kit for microoptical systems on the basis of microoptical benches (Abstract)

I. Sieber , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
A. Hofmann , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
U. Gengenbach , Inst. fur Angewandte Inf., Forschungszentrum Karlsruhe, Germany
pp. 84-89

Calculation of partial capacitances using a modified iterative complex image method (Abstract)

S. Rehfuss , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
C. Gorecki , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 90-94

A CMOS low noise amplifier for biomedical telemetry applications (Abstract)

R.L. Moreno , Microelectron. Group, Univ. Fed. de Itajuba, Sao Paulo, Brazil
E.C. Rodrigues , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 95-98

An approach of lateral RF MEMS switch for high performance (Abstract)

J. Li , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
M. Tang , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
P. Win , MEMSCAP, Crolles, France
Q.X. Zhang , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
A. Agarwal , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 99-102

Parallel-beams/lever electrothermal out-of-plane actuator (Abstract)

M.C. Elwenspoek , MESA Res. Inst., Twente Univ., Enschede, Netherlands
S. Deladi , MESA Res. Inst., Twente Univ., Enschede, Netherlands
G. Krijnen , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 103-107

Study and realisation of a micromechanical relay for use in a harsh environment (Abstract)

D. Collard , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
F. Conseil , Dept. ISEN, Inst. d'Electron., Villeneuve d'Ascq, France
P. Derderian , MESA Res. Inst., Twente Univ., Enschede, Netherlands
L. Buchaillot , MEMSCAP, Crolles, France
M.-F. Ravat , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 108-112

Integrated multistage MEMS-based optical switch (Abstract)

Yong Yin , MESA Res. Inst., Twente Univ., Enschede, Netherlands
Geng-Sheng Kuo , Nat. Chengchi Univ., Taipei, Taiwan
pp. 113-116

Three-dimensional MEMS simulation using Euler parameters (Abstract)

G. Casinovi , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 117-120

A new computational method for piezoelectric plate modeling: application to membrane microsensors (Abstract)

M. Emmenegger , MESA Res. Inst., Twente Univ., Enschede, Netherlands
L. Ferrario , Microelectron. Div., ITC-irst, Trento, Italy
H. Baltes , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
J.G. Korvink , MEMSCAP, Crolles, France
S. Taschini , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 121-126

Design and simulation of MEMS optical crossconnect with integrated nanophotonic crystals technology (Abstract)

H.G. Teo , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
A.Q. Liu , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
J. Singh , MESA Res. Inst., Twente Univ., Enschede, Netherlands
C. Lu , MESA Res. Inst., Twente Univ., Enschede, Netherlands
pp. 127-130

Construction of nonlinear dynamic MEMS component models using Cosserat theory (Abstract)

A. Richardson , MEMSCAP, Crolles, France
R. Rosing , MESA Res. Inst., Twente Univ., Enschede, Netherlands
D. Liu , Ind. Math. & Gravity Group, Lancaster Univ., UK
C. Wang , Ind. Math. & Gravity Group, Lancaster Univ., UK
B. De Masi , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 131-136

Theoretical aspects concerning the calculus possibilities of magnetic fluid core coils (Abstract)

A. Siblini , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
L. Jorat , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
N.C. Popa , Dispositifs et Instrum. en Optoeletron. et Micro-ondes, Univ. Jean Monnet, Saint-Etienne, France
pp. 143-148

Application of the "Multi Architecture Modeling" design method to system level MEMS simulation (Abstract)

G. Herrmann , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
D. Muller , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
M. Schlegel , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
pp. 149-153

Design and modelling of a microsensor for atmospheric electric field measurement (Abstract)

Zheng Cui , Rutherford Appleton Lab., Chilton, UK
Shanhong Xia , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
Chao Gong , Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
pp. 154-158

Computer aided design of a radiometric system for material sheet production (Abstract)

O. Nussen , ITEM, Bremen Univ., Germany
H. Bolte , ITEM, Bremen Univ., Germany
D. Peters , ITEM, Bremen Univ., Germany
D. Richter , MEMSCAP, Crolles, France
R. Laur , ITEM, Bremen Univ., Germany
pp. 159-163

Neural network approach for linearization of the electrostatically actuated double-gimballed micromirror (Abstract)

F.E.H. Tay , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
K.K.L. Cheo , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
F.E.H. Tay , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
Guangya Zhou , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
pp. 164-169

A new methodology for modeling MEMS Structures (Abstract)

Kaiping Zeng , Inst. for Microsyst. Technol., Freiburg Univ., Germany
Zhenyu Liu , Inst. for Microsyst. Technol., Freiburg Univ., Germany
J.G. Korvink , Inst. for Microsyst. Technol., Freiburg Univ., Germany
pp. 170-175

Dynamics modeling of microbeams under electrostatic load (Abstract)

A. Gugliotta , Inst. for Microsyst. Technol., Freiburg Univ., Germany
F. De Bona , DIEGM, Univ. degli Studi di Udine, Italy
A. Soma , Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
E. Brusa , DIEGM, Univ. degli Studi di Udine, Italy
pp. 181-186

Design and characterisation of a low-power micromachined spatial light modulator (Abstract)

G. McRobbie , MicroScale Sensors, Univ. of Paisley, UK
Zaikang Ling , MicroScale Sensors, Univ. of Paisley, UK
F. Clark , MicroScale Sensors, Univ. of Paisley, UK
pp. 187-191

Process stress estimation for MEMS RF switches with mixed analytical and numerical simulation (Abstract)

G. Soncini , Microsyst. Div., ITC-irst, Povo, Italy
B. Margesin , Microsyst. Div., ITC-irst, Povo, Italy
L. Ferrario , Microsyst. Div., ITC-irst, Povo, Italy
C. Armaroli , Microsyst. Div., ITC-irst, Povo, Italy
pp. 192-196

Model-based optimization of Medical Test Strips (Abstract)

R. Laur , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
D. Peters , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
H. Bolte , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
O. Nussen , Inst. for Electromagn. Theor. & Microelectron., Bremen Univ., Germany
pp. 197-200

3D silicon turning micromirror (Abstract)

Chien Chao-Heng , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
Chen Shi-Hao , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
pp. 201-203

Evaluation of principal characteristics of circular resonator in thin film applications (Abstract)

K. Varjonen , Tampere Univ. of Technol., Finland
A. Lehto , Tampere Univ. of Technol., Finland
S. Myllymaki , Tampere Univ. of Technol., Finland
E. Ristolainen , Tampere Univ. of Technol., Finland
P. Heino , Tampere Univ. of Technol., Finland
pp. 204-207

Thermal and mechanical simulation of bulk resonators (Abstract)

C. Cane , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
I. Gracia , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
L. Fonseca , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
M. Morata , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
E. Figueras , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
pp. 208-213

Analysis, and optimization of a CMOS vertical thermal actuator (Abstract)

M. Ismail , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
A. Mohamed , Electron. Res. Inst., Egypt
H. Elsimary , Electron. Res. Inst., Egypt
pp. 214-217

Numerical simulation of hydrogel-based pH-responsive biosensors in BioMEMS (Abstract)

Y.K. Yew , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
K.Y. Lam , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
Hua Li , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
T.Y. Ng , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 218-222

Capacitive humidity sensor using a polyimide sensing film (Abstract)

J. Laconte , Res. Center in Micro, Univ. Catholique de Louvain, Belgium
V. Wilmart , Res. Center in Micro, Univ. Catholique de Louvain, Belgium
J.-P. Raskin , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
D. Flandre , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 223-228

"Plug-up"-a new concept for fabricating SOI MEMS devices (Abstract)

T. Sillanpaa , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
T. Mattila , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
P. Pekko , Microlelctron., VTT Inf. Technol., Finland
H. Kattelus , Microlelctron., VTT Inf. Technol., Finland
J. Kiihamaki , Microlelctron., VTT Inf. Technol., Finland
pp. 229-233

A novel drie fabrication process development for SOI-based MEMS devices (Abstract)

A.Q. Liu , Microlelctron., VTT Inf. Technol., Finland
Q.X. Zhang , Microlelctron., VTT Inf. Technol., Finland
J. Li , Microelectron. Div., Nanyang Technol. Univ., Singapore
pp. 234-238

Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB (Abstract)

A. Jourdain , IMEC, Leuven, Belgium
H. Ziad , Microlelctron., VTT Inf. Technol., Finland
P. De Moor , Microlelctron., VTT Inf. Technol., Finland
H.A.C. Tilmans , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 239-244

Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process (Abstract)

C. Rusu , MEMS Group, Imego Inst., Gothenburg, Sweden
R. Gunn , Microlelctron., VTT Inf. Technol., Finland
H. Jansen , Microlelctron., VTT Inf. Technol., Finland
A. Witvrouw , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
pp. 245-250

Testing of a LIGA-microspectrometer for monitoring dissolved nickel concentration when etching nickel and its alloys in aqueous ferric chloride solutions (Abstract)

D.M. Allen , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
D. Boubal , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
H.J.A. Almond , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
pp. 251-254

Soldered sealing process to assemble a protective cap for a MEMS CSP (Abstract)

M. Wiemer , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
A. Ostmann , Sch. of Ind. & Manuf. Sci., Cranfield Univ., Bedford, UK
M. Hutter , Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
I. Kolesnik , Comput. MEMS Div., Inst. of High Performance Comput., Singapore, Singapore
Erik Jung , Fraunhofer-IZM, Berlin, Germany
pp. 255-260

Dielectric miceocavity resonators based on silicon mold (Abstract)

Jun Zhu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Jingquan Liu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Jiliang Zhang , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Di Chen , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
Yigui Li , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiao Tong Univ., China
pp. 261-264

Bonding of polymer microstructures by UV irradiation and welding at low temperatures (Abstract)

V. Saile , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
R. Truckenmuller , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
P. Henzi , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
D. Herrmann , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
W.K. Schomburg , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
pp. 265-267

SU8 resist plasma etching and its optimisation (Abstract)

M.E. Heaton , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
Guodong Hong , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
A.S. Holmes , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
pp. 268-271

New aspects of simulation in hot-embossing (Abstract)

M. Heckele , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
M. Worgull , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
pp. 272-274

A new electroforming technology in aid of pressure for LIGA process (Abstract)

Hsiharng Yang , Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Chia-Hua Chang , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
Reiyu Chein , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
Tsung-Shuin Tsai , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
Jen-Chin Wu , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
pp. 275-280

On-wafer electro-mechanical characterization of silicon MEMS switches (Abstract)

F. Giacomozzi , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
C. Collini , Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
K.J. Rangra , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe AC, Germany
B. Margesin , Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
L. Lorenzelli , ITC-irst Microsyst. Div., Trento, Italy
pp. 281-285

A novel self-sensitive SFM for nondestructive measurement of tiny vertical surfaces with restricted access (Abstract)

R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
T. Kobayashi , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
Y. Murakoshi , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
X.C. Shan , Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
pp. 286-289

Design and fabrication of a peristaltic micropump (Abstract)

J. House , Dept. of Electr. & Comput. Eng., OGI Sch. of Sci. & Eng., Beaverton, OR, USA
M. Knight , Dept. of Electr. & Comput. Eng., OGI Sch. of Sci. & Eng., Beaverton, OR, USA
pp. 290-294

Production metrology for MEMS characterization (Abstract)

T. Browne , Veeco Instrum., Plainvew, NY, USA
F. Pasop , Veeco Instrum., Plainvew, NY, USA
E. Novak , Veeco Instrum., Plainvew, NY, USA
pp. 295-299

Thin film formation-a fabrication on non-planar surface by spray coating method (Abstract)

R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
T. Ikehara , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
M. Ichiki , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Zhen Yang , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Lulu Zhang , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
pp. 300-303

Hot embossing characteristics of PEEK compared to PC and PMMA (Abstract)

T. Shimizu , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
R. Maeda , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Y. Murakoshi , Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
Y. Murakoshi , Integrated Solid-State Electr. Mech. Instrum., Nat. Inst. of Adv. Ind. Sci. & Technol, Tsukuba, Japan
pp. 304-311

Quantitative study of the 'M.E.M.S.N.A.S.' process for 3D microfabrication using binary lithography (Abstract)

S. Didelon , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
F. Marty , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
B. Mercier , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
T. Bourouina , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
C. Moyroud , Ecole Nat. Superieure d'Ingenieurs en Electron. et Electrotech., Noisy-Le-Grand, France
pp. 312-317

Ion track lithography: novel low-cost process to form deep vertical and high aspect ratio MEMS in flexible laminates (Abstract)

M. Lindeberg , Angstrom Lab., Uppsala Univ., Sweden
M. Skupinski , Angstrom Lab., Uppsala Univ., Sweden
K. Hjort , Angstrom Lab., Uppsala Univ., Sweden
H. Majjad , Angstrom Lab., Uppsala Univ., Sweden
pp. 318-323

Ensuring reliability and repeatability in LIGA mold insert fabrication (Abstract)

P. Meyer , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
A. Janssen , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
L. Hahn , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
M. Guttmann , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
F. Winkler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
U. Kohler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
J. Schulz , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
K. Bade , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 324-328

Fracture behaviour of single crystal silicon microstructures (Abstract)

F.F. Meroni , Inst. of Mech. Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
E. Mazza , Inst. of Mech. Syst., Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 329-334

Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging (Abstract)

B. Michel , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
O. Wittler , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
V. Grosser , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
J. Auersperg , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
B. Wunderle , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
E. Kaulfersch , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
pp. 335-340

Mechanical qualification of RF-filters for space applications (Abstract)

P. Pons , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
S. Rigo , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
M. Dardalhon , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
X. Lafontan , MEMSCAP, Crolles, France
J. Kuchenbecker , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
B. Guillon , Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin, Germany
F. Pressecq , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
P. Nerin , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 341-345

Getters films at wafer level for wafer to wafer bonded MEMS (Abstract)

M. Moraja , SAES Getters, Lainate, Italy
M. Amiotti , SAES Getters, Lainate, Italy
pp. 346-349

Fabrication sub-micron gratings based on embossing (Abstract)

Yigui Li , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Chun Hui , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Y. Kanamori , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
Jingquan Liu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Jun Zhu , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
pp. 350-352

Microfabrication of electroplated integrated chromium tips onto a silicon actuator (Abstract)

E. Lennon , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
F. Ayela , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
pp. 353-355

Hexagonal microlens array fabricated by proximity printing via UV lithography (Abstract)

Cheng-Tang Pan , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Ching-Kong Chao , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
Hsiharng Yang , Inst. of Precision Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan
Che-Ping Lin , Centre de Recherches sur les Tres Basses Temperatures, CNRS, Grenoble, France
pp. 356-361

Fabrication comb-drive device by MEMS and electroplating (Abstract)

Chen Shi-Hao , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
Chien Chao-Heng , Dept. of Mech. Eng., Tatung Univ., Taipei, Taiwan
pp. 362-366

A novel method for determining Young's modulus of thin films by micro-strain gauges (Abstract)

Chen Shi-Hao , Nat. Chin-Yi Inst. of Technol., Taichung, Taiwan
pp. 367-372

SU-8 process for biomedical inspection /spl mu/-carriers (Abstract)

P.-P. Ding , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
J.-S. Kuo , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
P.-H. Chen , Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 373-377

P/sup +/ silicon recessed micromechanical structures for MEMS applications (Abstract)

S. Tuli , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
P. Pal , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
S. Chandra , Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
pp. 378-381

A novel electrically controlled flexible liquid micro lens (Abstract)

S. Buttgenbach , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
M. Feldmann , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
S. Butefisch , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
pp. 382-386

Analysis of failure modes and mechanisms in thermally actuated micromachined relays for harsh environments space applications (Abstract)

Ashok Sharma , Inst. for Microtechnol., Technische Univ. Braunschweig, Germany
A. Teverovsky , QSS Group Inc., Lanham, MD, USA
pp. 387-393

Yield strength of thin-film parylene-c (Abstract)

T.A. Harder , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Ashok Sharma , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Yu-Chong Tai , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 394-398

Manufacturing of micro electrodes using ultra sonic aided electrochemical machining (Abstract)

Chen-Siang Hsu , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
R.F. Shyu , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Feng-Tsai Wang , Dept. of Mech. Manuf Eng., Nat. Huwei Inst. of Technol., Yunlin, Taiwan
C.T. Ho , Key Lab. for Thin Film & Microfabrication of Minist. of Educ., Shanghai Jiaotong Univ., China
pp. 399-401

Stress characterization of electroplated gold layers for low temperature surface micromachining (Abstract)

F. Giacomozzi , ITC-irst, Povo, Italy
R. Pal , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
B. Margesin , ITC-irst, Povo, Italy
M. Decarli , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
V. Guarnieri , ITC-irst, Povo, Italy
A. Faes , ITC-irst, Povo, Italy
A. Bagolini , ITC-irst, Povo, Italy
pp. 402-405

Feasibility of a flip chip approach to integrate an IR filter and an IR detector in a future gas detection cell (Abstract)

C. Calaza , ITC-irst, Povo, Italy
C. Cane , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
E. Cabruja , Centro Nacional de Microelectron., Bellaterra, Spain
L. Fonseca , Centro Nacional de Microelectron., Bellaterra, Spain
I. Gracia , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
R. Rubio , ITC-irst, Povo, Italy
J. Santander , ITC-irst, Povo, Italy
E. Figueras , Inst. fur Mikrostrukturtech., Forschungszentrum Karlsruhe, Germany
pp. 407-410

Authors Index (PDF)

pp. 412-413
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