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2012 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) (1995)
Lafayette, LA
Nov. 13, 1995 to Nov. 15, 1995
ISSN: 1063-6722
ISBN: 0-8186-7107-6
pp: 10
P.K. Nag , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
S. Griep , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
D. Schmitt-Landsiedel , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
T. Waas , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
W. Maly , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
H. Hartmann , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
I. Bubel , Fraunhofer-Inst. fur Festkorpertechnologie, Munich, Germany
ABSTRACT
This paper describes the AFFCCA (Accurate, Fast, Flexible Computation of Critical Area) tool. The algorithms implemented in AFFCCA can handle arbitrary geometry, defects causing shorts of arbitrary shapes, and a spectrum of process induced layout deformations. The presented results indicate that the unique features of AFFCCA allow for significant improvements in the accuracy of critical area computations.
INDEX TERMS
integrated circuit layout; circuit layout CAD; lithography; AFFCCA; critical area analysis tool; circular defects; lithography deformed layout; process induced layout deformations; IC critical area computations
CITATION
P.K. Nag, S. Griep, D. Schmitt-Landsiedel, T. Waas, W. Maly, H. Hartmann, I. Bubel, "AFFCCA: a tool for critical area analysis with circular defects and lithography deformed layout", 2012 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), vol. 00, no. , pp. 10, 1995, doi:10.1109/DFTVS.1995.476932
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