Electronic Design, Test and Applications, IEEE International Workshop on (2002)
Christchurch, New Zealand
Jan. 29, 2002 to Jan. 31, 2002
Ali Chehab , Multilink Technology Corporation
Rafic Makki , University of North Carolina at Charlotte
Michael Spica , Intel Corp.
David Wu , Intel Corp.
In this paper, we investigate three iDDT-based test methodologies, Double Threshold iDDT, Delta iDDT, and Delayed iDDT, and we compare their effectiveness in the detection of defects in very deep sub-micron random logic circuits. The target defects are resistive opens and resistive bridges. We present preliminary simulation results of 49 defects to study the defect sensitivity of each of the three test methods. This paper reports our preliminary results on these three test methods using a relatively small transistor-level sample circuit, and is not intended to imply any feasibility in a production environment. The test methods presented herein are the subject of a current invention disclosure.
M. Spica, D. Wu, A. Chehab and R. Makki, "IDDT Test Methodologies for Very Deep Sub-micron CMOS Circuits," Electronic Design, Test and Applications, IEEE International Workshop on(DELTA), Christchurch, New Zealand, 2002, pp. 403.