Computer Science and Information Engineering, World Congress on (2009)
Los Angeles, California USA
Mar. 31, 2009 to Apr. 2, 2009
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/CSIE.2009.853
The specifications required at the design stage for the thermal management of MEMS based on haptic sensing are studied. The use of a meshfree method is proposed for the computation in real time of the temperature distribution within the system. We describe the problematic of a haptic environment and the critical issues associated with the process of merging design and simulation.
Haptic, RPIM, MEMS, Meshfree, Design
O. Laghrouche, M. P. Desmulliez and J. Munier, "Investigation of the MeshFree RPIM Solution for a Haptic Sensing Approach to MEMS Design," 2009 WRI World Congress on Computer Science and Information Engineering, CSIE(CSIE), Los Angeles, CA, 2009, pp. 97-101.