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2012 IEEE 21st Asian Test Symposium (2012)
Niigata, Japan Japan
Nov. 19, 2012 to Nov. 22, 2012
ISSN: 1081-7735
ISBN: 978-1-4673-4555-2
pp: 270
Summary form only given, as follows. This panel discusses board/system level test requirements, current test technologies and challenges. We will also discuss what future new standards, technologies and tools are necessary to improve both the test quality and test efficiency for production boards. This panel will cover from an end-to-end standpoint to improve product quality and reliability, including DFT technologies in ASIC components, boards/systems, and intelligent diagnosis.

X. Gu, "Session Summary V: Is Component Interconnection Test Enough for Board or System Test," 2012 IEEE 21st Asian Test Symposium(ATS), Niigata, Japan Japan, 2012, pp. 270.
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