The Community for Technology Leaders
IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (2003)
Munich, Germany
March 31, 2003 to April 1, 2003
ISSN: 1078-8743
ISBN: 0-7803-7673-0
TABLE OF CONTENTS

Wafer backside inspection applications in lithography (PDF)

K. Lederer , Infineon Technol., Dresden, Germany
M. Scholze , Infineon Technol., Dresden, Germany
pp. 1-8

Productivity enhancement using a methodical approach to defect reduction based on synergy of process and defect metrology knowledge (PDF)

R. Schreutelkamp , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
T. King , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
K. Mast , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
I. Englard , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
J. Zondag , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
M. van der Reijden , Technol. Group Philips Account, Appl. Mater. Eur., Nijmegen, Netherlands
pp. 9-16

Investigation of reticle defect formation at DUV lithography (PDF)

K. Bhattacharyya , KLA-Tencor Corp., San Jose, CA, USA
W. Volk , KLA-Tencor Corp., San Jose, CA, USA
pp. 29-35

Process advances in plasma photoresist and residue removal with the use of H/sub 2/O vapor (PDF)

R. Sonnemans , Axcelis Technol. Inc., Rockville, MD, USA
C. Waldfried , Axcelis Technol. Inc., Rockville, MD, USA
pp. 36-40

Laser shock cleaning of inorganic micro and nanoscale particles (PDF)

A.A. Busnaina , NSF Center for Microcontamination Control, Northeastern Univ., Boston, MA, USA
pp. 41-45

Alignment and overlay metrology using a spectroscopic diffraction method (PDF)

Weidong Yang , Nanometrics Inc., Milpitas, CA, USA
R. Lowe-Webb , Nanometrics Inc., Milpitas, CA, USA
J. Heaton , Nanometrics Inc., Milpitas, CA, USA
pp. 46

Precision and accuracy of CD-SEM profile reconstruction for the 110 technology node (PDF)

T. Marschner , Unit Process Dev. Dept., Infineon Technol., Dresden, Germany
pp. 53-58

Pupilgram imperfections and their effect on lithography (PDF)

S.P. Renwick , Nikon Precision Inc., Belmont, CA, USA
S.D. Slonaker , Nikon Precision Inc., Belmont, CA, USA
pp. 59-66

Process control and base line monitoring using optical 'On the Fly' and SEM classification as implemented in advanced DRAM manufacturing (PDF)

S. Ralf , Defect Density Group, Infineon Technol. GmbH, Dresden, Germany
P. Sina , Defect Density Group, Infineon Technol. GmbH, Dresden, Germany
pp. 67-72

Real time evaluation of an air leak into a dry etching equipment by means of optical emission spectroscopy: evaluation and results in high volume production regime (PDF)

F. Ciovacco , STMicroelectronics, Agrate Brianza, Italy
S. Alba , STMicroelectronics, Agrate Brianza, Italy
G. Fazio , STMicroelectronics, Agrate Brianza, Italy
F. Somboli , STMicroelectronics, Agrate Brianza, Italy
pp. 73-74

Setting performance targets in a 300 mm wafer fabrication facility (PDF)

N. Govind , Dept. of Ind. & Manuf. Eng., Pennsylvania State Univ., USA
pp. 75-79

Next generation production on 300 mm from pilot to volume (PDF)

K. Egger , Infineon Technol. SC300 GmbH & Co. KG, Dresden, Germany
pp. 80

A dynamic system regulation measure for increasing effective capacity: the X-factor theory (PDF)

D. Delp , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
J. Si , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 81-88

A scheduling and resource optimising MES for the semiconductor and MEMS industry (PDF)

J. Sieberg , ABAKUS Software GmbH, Dresden, Germany
R. Walter , ABAKUS Software GmbH, Dresden, Germany
pp. 101-105

Cycle time reduction at a major Texas Instruments wafer fab (PDF)

K. Potti , DMOS 5 Wafer Fab, Texas Instrum. Inc., Dallas, TX, USA
M. Whitaker , DMOS 5 Wafer Fab, Texas Instrum. Inc., Dallas, TX, USA
pp. 106-110

Simulation-based evaluation of the ramp-up behavior of waferfabs (PDF)

R. Sturm , Dept. Cleanroom Manuf., Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
J. Dorner , Dept. Cleanroom Manuf., Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
K. Reddig , Dept. Cleanroom Manuf., Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
J. Seidelmann , Dept. Cleanroom Manuf., Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
pp. 111-117

The influence of processing conditions on data retention behavior in a deep submicron NVM process (PDF)

M. Karnett , Philips Semicond., San Antonio, TX, USA
S. Qian , Philips Semicond., San Antonio, TX, USA
R. Solis , Philips Semicond., San Antonio, TX, USA
X. Tao , Philips Semicond., San Antonio, TX, USA
A. Black , Philips Semicond., San Antonio, TX, USA
S. Boonsanguan , Philips Semicond., San Antonio, TX, USA
A. Liu , Philips Semicond., San Antonio, TX, USA
pp. 118-124

Effect of PECVD SiC and SiCN cap layer deposition on mesoporous silica ultra low k dielectric films (PDF)

S.E. Schulz , Center of Microtechnologies, Chemnitz Univ. of Technol., Germany
K. Schulze , Center of Microtechnologies, Chemnitz Univ. of Technol., Germany
pp. 131-132

An ultra thin nitrided oxide gate dielectric formation by using slot plane antenna plasma (PDF)

S. Ozaki , Kansai Technol. Dev. Center, Tokyo Electron Ltd, Hyogo, Japan
S. Matsuyama , Kansai Technol. Dev. Center, Tokyo Electron Ltd, Hyogo, Japan
pp. 137-141

Cobalt silicide re-deposition during batch spray strip process resulting in open contacts (PDF)

A. El-Sayed , Kilby Center, Texas Instruments, Dallas, TX, USA
S. Collins , Kilby Center, Texas Instruments, Dallas, TX, USA
D. Frystak , Kilby Center, Texas Instruments, Dallas, TX, USA
L. Loewenstein , Kilby Center, Texas Instruments, Dallas, TX, USA
pp. 148-153

Characterisation of silicon oxynitrides and high-k dielectric materials by angle-resolved X-ray photoelectron spectroscopy (PDF)

P. Mack , Thermo VG Sci., East Grinstead, UK
R. White , Thermo VG Sci., East Grinstead, UK
J. Wolstenholme , Thermo VG Sci., East Grinstead, UK
A. Wright , Thermo VG Sci., East Grinstead, UK
pp. 154-159

Cost of yield (PDF)

D.N. Maynard , IBM Microeletronics Div., Essex Junction, VT, USA
D.S. Kerr , IBM Microeletronics Div., Essex Junction, VT, USA
C. Whiteside , IBM Microeletronics Div., Essex Junction, VT, USA
pp. 165-170

Dopant redistribution and loss during ternary silicide Co/sub x/Ni/sub 1-x/Si/sub 2/ formation (PDF)

Y.Q. Xu , Texas Instrum. Inc., Dallas, TX, USA
J. Zhao , Texas Instrum. Inc., Dallas, TX, USA
J.P. Lu , Texas Instrum. Inc., Dallas, TX, USA
D. Miles , Texas Instrum. Inc., Dallas, TX, USA
J. Loewecke , Texas Instrum. Inc., Dallas, TX, USA
P. Tiner , Texas Instrum. Inc., Dallas, TX, USA
pp. 171-174

Equipment engineering systems (PDF)

E. Schobel , AIS Autom., Dresden, Germany
pp. 195-201

Evaluation of final test process in 64-Mbit DRAM manufacturing system through simulation analysis (PDF)

K. Nakamae , Dept. of Inf. Syst. Eng., Osaka Univ., Japan
H. Ikeda , Dept. of Inf. Syst. Eng., Osaka Univ., Japan
H. Fujioka , Dept. of Inf. Syst. Eng., Osaka Univ., Japan
pp. 202-207

Fault detection and isolation for plasma etching using model-based approach (PDF)

Mu-Huo Cheng , Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Huan-Shin L , Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Shin-Yeu Lin , Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 208-214

Guided analytic application for interactive flash memory Vt and I-V classification using Spotfire DecisionSite (PDF)

S. Shetty , AMD, Submicron Dev. Center, Sunnyvale, CA, USA
C.B. Hopper , AMD, Submicron Dev. Center, Sunnyvale, CA, USA
pp. 215-224

How UV selectable illumination inspection tool and methodologies can accelerate learning curve of advanced technologies (PDF)

V. Turines , ST Microelectron. Crolles, France
C. Archambault , ST Microelectron. Crolles, France
B. Hinschberger , ST Microelectron. Crolles, France
E. Rouchouze , ST Microelectron. Crolles, France
pp. 225-230

Image field upgrade to improve tool productivity (PDF)

M.J. Dahmen , Process Eng. & Dev., Infineon Technol. Austria AG, Villach, Austria
pp. 231-233

Impact of additional LDD rapid thermal annealing on submicron n-MOSFETs (PDF)

Qian Wensheng , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
V.K.W. Leong , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
Wang Yuwen , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
Li Yisuo , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
Pandey Shesh Mani , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
S. Manju , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
F. Benistant , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
S. Chu , Chartered Semicond. Manuf. Ltd., Singapore, Singapore
pp. 234-237

Implementing fiducial probe card alignment technology for production wafer probing (PDF)

D. Langlois , Altis Semicond. Inc., Essones, France
M. Fardel , Altis Semicond. Inc., Essones, France
pp. 238-243

Introduction of infrared spectroscopic ellipsometry in a semiconductor production environment (PDF)

P. Weidner , Infineon Technol. Dresden GmbH, Germany
U. Mantz , Infineon Technol. Dresden GmbH, Germany
P.Y. Guittet , Infineon Technol. Dresden GmbH, Germany
R. Wienhold , Infineon Technol. Dresden GmbH, Germany
M. Rimane , Infineon Technol. Dresden GmbH, Germany
pp. 244-249

An overview of thermal management for next generation microelectronic devices (PDF)

S.S. Tonapi , Gen. Electr. Global Res., Niskayuna, NY, USA
R.A. Fillion , Gen. Electr. Global Res., Niskayuna, NY, USA
F.J. Schattenmann , Gen. Electr. Global Res., Niskayuna, NY, USA
H.S. Cole , Gen. Electr. Global Res., Niskayuna, NY, USA
J.D. Evans , Gen. Electr. Global Res., Niskayuna, NY, USA
pp. 250-254

Reliability considerations for gas delivery components (PDF)

J. Savadkouhi , Mykrolis Corp., Allen, TX, USA
pp. 255-261

Yield enhancement challenges for 90 nm and beyond (PDF)

H. Goel , Texas Instrum. Inc., Dallas, TX, USA
pp. 262-265

Rapid reduction of gate-level electrical defectivity using voltage contrast test structures (PDF)

O.D. Patterson , Agere Syst., Orlando, FL, USA
B.D. Crevasse , Agere Syst., Orlando, FL, USA
K.K. Harris , Agere Syst., Orlando, FL, USA
B.B. Patel , Agere Syst., Orlando, FL, USA
G.W. Cochran , Agere Syst., Orlando, FL, USA
pp. 266-272

Integrated web-based architecture for correlative engineering data analysis and decision support (PDF)

N. Tandon , Kilby Center (KFAB), Texas Instruments, Dallas, TX, USA
D. Cleverdon , Kilby Center (KFAB), Texas Instruments, Dallas, TX, USA
B. Hinshaw , Kilby Center (KFAB), Texas Instruments, Dallas, TX, USA
pp. 273-279

A semiconductor valid device development and production control methodology (PDF)

S. Leibiger , Fairchild Semicond. Corp., South Portland, ME, USA
pp. 280-285

Reducing the overkills and retests in wafer testing process (PDF)

S.C. Horng , Dept. of Elec. & Contr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
S.Y. Lin , Dept. of Elec. & Contr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
M.H. Cheng , Dept. of Elec. & Contr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 286-291

NPN yield improvement with ozone surface treatment prior to emitter poly deposition (PDF)

D. Hilscher , Philips Semicond., Hopewell Junction, NY, USA
T. Tran-Quinn , Philips Semicond., Hopewell Junction, NY, USA
R. Cook , Philips Semicond., Hopewell Junction, NY, USA
M.S. Fung , Philips Semicond., Hopewell Junction, NY, USA
J.W. Andrews , Philips Semicond., Hopewell Junction, NY, USA
N. Bell , Philips Semicond., Hopewell Junction, NY, USA
D. Szmyd , Philips Semicond., Hopewell Junction, NY, USA
V. Saikuma , Philips Semicond., Hopewell Junction, NY, USA
R. Ketcheson , Philips Semicond., Hopewell Junction, NY, USA
P. Kellawon , Philips Semicond., Hopewell Junction, NY, USA
S. Calvelli , Philips Semicond., Hopewell Junction, NY, USA
pp. 292-296

Continuously optimizing the value of an installed base of semiconductor manufacturing equipment (PDF)

G. van der Feltz , ASML Installed Base Solutions, Veldhoven, Netherlands
F. Lamers , ASML Installed Base Solutions, Veldhoven, Netherlands
H. Priem , ASML Installed Base Solutions, Veldhoven, Netherlands
R. Melief , ASML Installed Base Solutions, Veldhoven, Netherlands
pp. 310-314

Advanced analysis of dynamic neural control advisories for process optimization and parts maintenance (PDF)

J.P. Card , IBEX Process Technol. Inc., Lowell, MA, USA
W.T. Chan , IBEX Process Technol. Inc., Lowell, MA, USA
A. Cao , IBEX Process Technol. Inc., Lowell, MA, USA
W. Martin , IBEX Process Technol. Inc., Lowell, MA, USA
pp. 315-321

Efficient lot batching system for furnace operation (PDF)

K. Ibrahim , Silterra (M) Sdn Bhd, Kedah, Malaysia
M.A. Chik , Silterra (M) Sdn Bhd, Kedah, Malaysia
W.S. Nizam , Silterra (M) Sdn Bhd, Kedah, Malaysia
N.L. Fern , Silterra (M) Sdn Bhd, Kedah, Malaysia
N.F. Za'bah , Silterra (M) Sdn Bhd, Kedah, Malaysia
pp. 322-324

Authors/presenters (PDF)

pp. 326-330
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