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Adhesive Joining and Coating Technology in Electronics Manufacturing (1998)
Binghamton, NY, USA
Sept. 28, 1998 to Sept. 30, 1998
ISBN: 0-7803-4934-2
TABLE OF CONTENTS

Fracture behaviour of isotropically conductive adhesives (Abstract)

S. Gupta , Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
pp. 38-43

Chemical kinetic model of interfacial degradation of adhesive joints (Abstract)

D.C.C. Lam , Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
pp. 44-48

Visco-elastic-plastic behaviors of polymer-based packaging materials (Abstract)

Z. Qian , Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
pp. 62-67

Models of electrical conduction in nanoparticle filled polymers (Abstract)

P. McCluskey , CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
pp. 84-89

High density flip chip interconnections produced with in-situ underfills and compatible solder coatings (Abstract)

K. Puhakka , Lab. of Electron. Manuf., Helsinki Univ. of Technol., Espoo, Finland
pp. 96-100

Flexible polyimide interposer for CSP preparation (Abstract)

V. Beyer , Semicond. Technol. & Microsyst. Lab., Tech. Univ. Dresden, Germany
pp. 112-115

Parametric dependence of fatigue of electronic adhesives (Abstract)

A. Gladkov , Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 116-124

Effect of bump height on flip-chip joint reliability using ACA (Abstract)

K. Persson , Swedish Inst. of Production Eng. Res., Molndal, Sweden
pp. 132-136

Anisotropic conductive paste available for flip chip (Abstract)

Y. Kishimoto , Toshiba Chem. Corp., Kawasaki, Japan
pp. 137-143

Advanced packaging and substrate technology using conductive adhesives (Abstract)

K. Eda , Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
pp. 144-151

Investigations of plasma compatibility of SMT assembly adhesives (Abstract)

K.-J. Wolter , Dept. of Electr. Eng., Tech. Univ. Dresden, Germany
pp. 152-155

Fundamental study on adhesive strength of electrical conductive adhesives (ECAs) (Abstract)

T. Inada , Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 156-159

Processing-adhesion relations for die attach adhesives and underfill resins (Abstract)

J. Taweeplengsangsuke , Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
pp. 160-167

Micro-jet printing of polymers for electronics manufacturing (Abstract)

D.J. Hayes , MicroFab Technol. Inc., Plano, TX, USA
pp. 168-173

Alternate safe solvents in hybrid circuit processing (Abstract)

A. Riso , Rossi Technol. Corp., Orangeburg, NY, USA
pp. 174-177

Dispensing flip chip underfill process problems and solutions (Abstract)

M. Norris , Speedline Technol. Fluids Dispensing Syst., Haverhill, MA, USA
pp. 178-183

Lubricants of silver fillers for conductive adhesive applications (Abstract)

C.P. Wong , Mater. Sci. & Eng. & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 184-192

Metrology of adhesive layers using acoustic microscopy (Abstract)

S. Canumalla , Sonoscan Inc., Bensenville, IL, USA
pp. 193-201

New method for observation of polyimide adhesion on non-planar surfaces (Abstract)

V. Sidorov , Dept. of Electr. Eng., Israel Inst. of Technol., Haifa, Israel
pp. 202-205

Thermal cycling analysis of TAB OLB connection with ACF (Abstract)

N.H. Yeung , Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Hong Kong
pp. 206-210

Reliability assessment of connection using HSC on LCD (Abstract)

C.M.L. Wu , Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Hong Kong
pp. 220-223

Flip-chip packaging with micromachined conductive polymer bumps (Abstract)

K.W. Oh , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 224-228

Novel fast cure and reworkable underfill materials (Abstract)

B. Ma , Nat. Starch and Chem. Co., Bridgewater, NJ, USA
pp. 252-255

New generation pre-deposited (no-flow) underfill for low-cost flip chip assembly (Abstract)

M.G. Firmstone , Div. of Adv. Products, Multicore Solders Ltd., Hemel Hempstead, UK
pp. 256-261

Dieneurethane adhesives in electronics (Abstract)

O. Figovsky , Eurotech Ltd., Haifa, Israel
pp. 266-269

The recent advances in surface mount conductive adhesives (Abstract)

Q.K. Tong , Nat. Starch and Chem. Co., Bridgewater, NJ, USA
pp. 272-277

Conductive adhesives with improved thermomechanical properties (Abstract)

H. Schaefer , Fraunhofer-Inst. fur Angewandte Materialforschung, Bremen, Germany
pp. 278-281

Nanocomposite materials offer higher conductivity and flexibility [conducting polymers] (Abstract)

P. McCluskey , CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
pp. 282-286

Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections (Abstract)

R. Miessner , Fraunhofer-Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
pp. 299-304

Viscosity measurements and models of underfill mixtures (Abstract)

P.C. Li , Dept. of Phys., State Univ. of New York, Binghamton, NY, USA
pp. 328-333

Conductive adhesive materials for lead solder replacement. II (Abstract)

O. Suzuki , Div. of Res. & Dev., Namics Corp., Niigata, Japan
pp. 351-355

A study on the effect of surface roughness on the strength of single lap joints (Abstract)

R. Gomatam , Dept. of Polymer Eng., Akron Univ., OH, USA
pp. 362-361

On the life prediction and accelerated testing of solder joints (Abstract)

Z. Qian , Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
pp. 363-361

Effect of the T-stress in the adhesively bonded joints on the locus of failure in rubber toughened epoxy system (Abstract)

B. Chen , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 364-361

Numerical analysis of adhesive shrinkage due to thermal cycling (Abstract)

S. Guo , Dept. of Eng. Sci. & Mech., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 365-361

Conference Author Index (Abstract)

pp. 369-370
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