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Proceedings IEEE Workshop on Applications of Computer Vision (1992)
Palm Springs, CA, USA
Nov. 30, 1992 to Dec. 2, 1992
ISBN: 0-8186-2840-5
pp: 290-297
A. Khotanzad , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
H. Banerjee , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
M. Srinath , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
ABSTRACT
The paper describes a vision system for automatic inspection of the connecting part of the wire bond of an IC where the wire connects to the bond pad on the chip. It considers a popular type of such bonds known as 'ball bond'. Using two-dimensional images taken from the top of the IC wafer, the system determines several geometric measures which are important in determining the quality of the bond. These measures include the boundary, length of major and minor axes of the best fitting ellipse and the center. The process utilizes automatic thresholding, morphological operations and geometric moments of the image. Success of the method is demonstrated through experimental studies on actual bonds.<>
INDEX TERMS
automatic optical inspection, integrated circuit testing, monolithic integrated circuits, packaging, VLSI
CITATION

A. Khotanzad, H. Banerjee and M. Srinath, "A vision system for inspection of ball bonds in integrated circuits," Proceedings IEEE Workshop on Applications of Computer Vision(ACV), Palm Springs, CA, USA, , pp. 290-297.
doi:10.1109/ACV.1992.240300
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