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Issue No.04 - July/August (2011 vol.31)
pp: 63-75
Ayse K. Coskun , Boston University
Jie Meng , Boston University
David Atienza , Ecole Polytechnique Federale de Lausanne
Mohamed M. Sabry , Ecole Polytechnique Federale de Lausanne
<p>This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.</p>
multiprocessor systems, emerging technologies, energy-aware systems, temperature-aware design, active cooling, 3D liquid-cooled systems
Ayse K. Coskun, Jie Meng, David Atienza, Mohamed M. Sabry, "Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling", IEEE Micro, vol.31, no. 4, pp. 63-75, July/August 2011, doi:10.1109/MM.2011.39
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