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Issue No.04 - July/August (2009 vol.29)
pp: 62-73
Michael R.T. Tan , Hewlett-Packard
Paul Rosenberg , Hewlett-Packard
Jong-Souk Yeo , Hewlett-Packard
Moray McLaren , Hewlett-Packard
Sagi Mathai , Hewlett-Packard
Terry Morris , Hewlett-Packard
Huei Pei Kuo , Hewlett-Packard
Joseph Straznicky , Hewlett-Packard
Norman P. Jouppi , Hewlett-Packard
Shih-Yuan Wang , Hewlett-Packard
<p>Signal integrity constraints of high-speed electronics have made multidrop electrical buses infeasible. This high-speed alternative uses hollow metal waveguides and pellicle beam splitters that interconnect modules attached to the bus. With 1 mW of laser power, the bus can interconnect eight modules at 10 Gbps per channel and achieves an aggregate bandwidth of more than 25 Gbytes per second with 10-bit-wide signaling paths.</p>
I/O and data communications, buses, multicast, optical interconnects, interprocessor communications, interconnection architectures, fiber optics, memory wall, hardware
Michael R.T. Tan, Paul Rosenberg, Jong-Souk Yeo, Moray McLaren, Sagi Mathai, Terry Morris, Huei Pei Kuo, Joseph Straznicky, Norman P. Jouppi, Shih-Yuan Wang, "A High-Speed Optical Multidrop Bus for Computer Interconnections", IEEE Micro, vol.29, no. 4, pp. 62-73, July/August 2009, doi:10.1109/MM.2009.57
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