Issue No. 03 - May/June (2003 vol. 23)
Amaury N?ve , Universit? catholique de Louvain
Denis Flandre , Universit? catholique de Louvain
Jean-Jacques Quisquater , Universit? catholique de Louvain
<p>Chips based on silicon-on-insulator technology meet the tough performance and security requirements presented by smart cards. A test chip manufactured in a fully depleted SOI process incorporates a charge pump and random-number generator, critical smart-card circuit blocks.</p>
J. Quisquater, D. Flandre and A. N?ve, "SOI Technology for Future High-Performance Smart Cards," in IEEE Micro, vol. 23, no. , pp. 58-67, 2003.