The Community for Technology Leaders
Green Image
Issue No. 04 - July/August (1998 vol. 18)
ISSN: 0272-1732
pp: 24-32
The demand of processing and transmitting fast-expanding information in the shortest time frame is driving the electronic components in computer and communication systems into "High Frequency" realm. In the meantime, the demand of light-weight, compact, and low-cost consumer electronics is driving the integrated circuits and systems to be smaller and cheaper. When these two trends merge together, the designers are facing a challenge: How to ensure the electronic components are functioning correctly in a smaller-than-ever environment with all the possible high-frequency parasitic effect? Chip-package co-design therefore becomes a focus in the hope of solving this issue.
high frequency, integrated circuits, chip-package co-design, electronic packaging.

J. Lin, "Chip-Package Codesign for High-Frequency Circuits and Systems," in IEEE Micro, vol. 18, no. , pp. 24-32, 1998.
94 ms
(Ver 3.3 (11022016))