Issue No. 04 - July/August (1998 vol. 18)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/40.710866
The silicon revolution continues its rapid advances. New functionality in silicon, more I/Os per components and shrinking discreet components sizes are providing the opportunity for rapid product enhancements. Area array packages and now the new chip-size packages are creating a demand for higher and higher PCB density. The PCB has been the venerable cost-effective packaging solution of choice.
PCB packaging, PCM density, array packages, chip-size packaging
H. Holden, "Microvias: The Next Generation of Substrates and Packages," in IEEE Micro, vol. 18, no. , pp. 10-16, 1998.