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Issue No.02 - March/April (1993 vol.13)
pp: 19-27
<p>The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications.</p>
David H. Carey, "Trends in Low-Cost, High-Performance Substrate Technology", IEEE Micro, vol.13, no. 2, pp. 19-27, March/April 1993, doi:10.1109/40.207085
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