Issue No. 02 - March/April (1993 vol. 13)
DOI Bookmark: http://doi.ieeecomputersociety.org/10.1109/40.207085
<p>The trends in high density interconnection (HDI) multichip module (MCM) techniques that have the potential to reduce interconnection cost and production time are described. The implementation in laminated dielectric (MCM-L) technology of a workstation processor core illustrates current substrate technology capabilities. The design, routing, layout and thermal management of the processor core are described. Thin-film deposited dielectric (MCM-D) technology is discussed as a cost-effective method for future interconnection applications.</p>
D. H. Carey, "Trends in Low-Cost, High-Performance Substrate Technology," in IEEE Micro, vol. 13, no. , pp. 19-27, 1993.