Issue No. 06 - Dec. (2012 vol. 29)
This paper presents the details of a standard, named OpenDFM, which describes an efficient method to ensure manufacturability of integrated circuits that are designed at advanced technology nodes of today and one that can scale to address similar issues at future nodes as well. OpenDFM uses a meta-language format to capture and improve critical patterns that must be tested to ensure correct manufacturing and thus enhance yield.
Semiconductor device manufacture, Semiconductor device packaging, System-on-a-chip, Schedules, Economics, Manufacturing,OpenDFM, EDA Standards, Semiconductor Manufacturability,
J. Buurma, R. Sayah, F. Valente, C. Rodgers, "OpenDFM Bridging the Gap Between DRC and DFM", IEEE Design & Test of Computers, vol. 29, no. , pp. 84-90, Dec. 2012, doi:10.1109/MDT.2012.2210380