The Community for Technology Leaders
RSS Icon
Issue No.06 - Nov.-Dec. (2011 vol.28)
pp: 76-84
Louay Abdallah , TIMA Laboratory
Salvador Mir , TIMA Laboratory
Christophe Kelma , NXP Semiconductors
<p>This article proposes a new class of sensors for built-in test in RF devices. These sensors are placed in close proximity to the DUT on the same substrate without being electrically connected to it. Instead, they monitor it by virtue of being subjected to the same process variations. The authors also describe other types of sensors they have studied, including DC probes, an envelope detector, and a current sensor.</p>
design and test, RF test, built-in test, on-chip sensors, alternate test, DUT
Louay Abdallah, Haralampos-G. Stratigopoulos, Salvador Mir, Christophe Kelma, "RF Front-End Test Using Built-in Sensors", IEEE Design & Test of Computers, vol.28, no. 6, pp. 76-84, Nov.-Dec. 2011, doi:10.1109/MDT.2011.131
1. J. Ferrario et al., "A Low-Cost Test Solution for Wireless Phone RFICs," IEEE Comm. Magazine, vol. 41, no. 9, 2003, pp. 82-88.
2. M.G. Méndez-Rivera et al., "An On-Chip Spectrum Analyzer for Analog Built-in Testing," J. Electronic Testing: Theory and Applications, vol. 21, no. 3, 2005, pp. 205-219.
3. G. Huertas et al., "Testing Mixed-Signal Cores: A Practical Oscillation-Based Test in an Analog Macrocell," IEEE Design & Test, vol. 19, no. 6, 2002, pp. 73-82.
4. S.S. Akbay et al., "Low-Cost Test of Embedded RF/ Analog/Mixed-Signal Circuits in SOPs," IEEE Trans. Advanced Packaging, vol. 27, no. 2, 2004, pp. 352-363.
5. P.N. Variyam, S. Cherubal, and A. Chatterjee, "Prediction of Analog Performance Parameters Using Fast Transient Testing," IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems, vol. 21, no. 3, 2002, pp. 349-361.
6. H.-G. Stratigopoulos et al., "Defect Filter for Alternate RF Test," Proc. 14th IEEE European Test Symp. (ETS 09), IEEE CS Press, 2009, pp. 101-106.
7. D. Boning and S. Nassif, "Models of Process Variations in Device and Interconnect," Design of High-Performance Microprocessor Circuits, A. Chandrakasan, W.J. Bowhill, and F. Fox eds., Wiley-IEEE Press, 2000, pp. 98-115.
8. B.E. Stine, D.S. Boning, and J.E. Chung, "Analysis and Decomposition of Spatial Variation in Integrated Circuit Processes and Devices," IEEE Trans. Semiconductor Manufacturing, vol. 10, no. 1, 1997, pp. 24-41.
9. K. Bernstein et al., High Speed CMOS Design Styles, Springer, 1998.
10. A. Valdes-Garcia et al., "A Broadband CMOS Amplitude Detector for On-Chip RF Measurements," IEEE Trans. Instrumentation and Measurement, vol. 57, no. 7, 2008, pp. 1470-1477.
11. Y. Maidon et al., "3.3 V CMOS Built-in Current Sensor," Electronics Letters, vol. 33, no. 5, 1997, pp. 345-346.
12. A. Bounceur, S. Mir, and H.-G. Stratigopoulos, "Estimation of Analog Parametric Test Metrics Using Copulas," IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 9, 2011, pp. 1400-1410.
30 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool